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AS6UA51216 Datasheet, PDF (1/9 Pages) Alliance Semiconductor Corporation – 1.65V to 3.6V 512K×16 Intelliwatt low power CMOS SRAM with one chip enable
Advance Information
June 2000
AS6UA51216
1.65V to 3.6V 512K×16 Intelliwatt™ low power CMOS SRAM with one chip enable
Features
• AS6UA51216
• Intelliwatt™ active power circuitry
• Industrial and commercial temperature ranges available
• Organization: 524,288 words × 16 bits
• 2.7V to 3.6V at 55 ns
• 2.3V to 2.7V at 70 ns
• 1.65V to 2.3V at 100 ns
• Low power consumption: ACTIVE
- 144 mW at 3.6V and 55 ns
- 68 mW at 2.7V and 70 ns
- 28 mW at 2.3 V and 100 ns
Logic block diagram
A0
A1
A2
A3
A4
A6
A7
A8
A12
A13
I/O1–I/O8
I/O9–I/O16
I/O
buffer
VDD
512K × 16
VSS
Array
(8,388,608)
Control circuit
WE
Column decoder
UB
OE
LB
CS
Selection guide
VCC Range
Min
Typ2
Max
Product
(V)
(V)
(V)
AS6UA51216
2.7
3.0
3.6
AS6UA51216
2.3
2.5
2.7
AS6UA51216
1.65
2.0
2.3
• Low power consumption: STANDBY
- 72 µW max at 3.6V
- 41 µW max at 2.7V
- 28 µW max at 2.3V
• 1.2V data retention
• Equal access and cycle times
• Easy memory expansion with CS, OE inputs
• Smallest footprint packages
- 48-ball FBGA
- 400-mil 44-pin TSOP II
• ESD protection ≥ 2000 volts
• Latch-up current ≥ 200 mA
Pin arrangement (top view)
44-pin 400-mil TSOP II
A4
A3
A2
A1
A0
CS
I/O1
I/O2
I/O3
I/O4
VCC
I/VOS5S
I/O6
I/O7
I/O8
WE
A18
A17
A16
A15
A14
1 44
2 43
3 42
4 41
5 40
6 39
7 38
8 37
9 36
10 35
11 34
12 33
13 32
14 31
15 30
16 29
17 28
18 27
19 26
20 25
21 24
22 23
A5
A6
A7
OE
UB
LB
I/O16
I/O15
I/O14
I/O13
VVI/CSOSC12
I/O11
I/O10
I/O9
A8
A9
A10
A11
A12
A13
Note: A “MODE” pad is to be placed between pins 33 and 34 and 11 and 12,
shorted. The bonding of this pad to VCC or VSS configures the device. There should
only be 44+2+2 pads on the chip. Two extra VCC to separate out Array from
Peripheral and Two-Mode Pads.
48-CSP Ball-Grid-Array Package
123456
A LB OE A0 A1 A2 NC
B I/O9 UB A3 A4 CS I/O1
C I/O10 I/O11 A5 A6 I/O2 I/O3
D VSS I/O12 A17 A7 I/O4 VCC
E VCC I/O13 VSS A16 I/O5 VSS
F I/O15 I/O14 A14 A15 I/O6 I/O7
G I/O16 NC A12 A13 WE I/O8
H A18 A8 A9 A10 A11 NC
Speed
(ns)
55
70
100
Power Dissipation
Operating (ICC1)
Max (mA)
Standby (ISB2)
Max (µA)
2
20
1
15
1
12
6/27/00
ALLIANCE SEMICONDUCTOR
1
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