SSGM_15 Datasheet, PDF (5/5 Pages) ALPS ELECTRIC CO.,LTD. – 2 to 10 Circuits-designed Type

Dual In-line Package Type Switches Soldering Conditions
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple φ 0.1 to 0.2 CA（K）or CC（T）at soldering portion（copper foil surface）.
A heat resisting tape should be used for fixed measurement.
3. Temperature profile
300
200
100
Room
temperature
Pre-heating
D max.
E max.
F
A max.
B
C
Time (s)
20 max.
Series（Reflow type）
SSGM
A（℃）
3s max.
250
B（℃）
240
C（℃）
150
D（s）
180
E（s）
----
F（s）
----
Notes
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's
temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc. The above-stated
conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.
Reference for Hand Soldering Condition
Soldering temperature
350±5℃
Soldering time
5s max.
Reference for Dip Soldering Condition
(For insertion terminal types)
Items
Preheating temperature
Preheating time
120℃ max.
90s max.
Dip soldering
Soldering temperature
Duration of immersion
270±5℃
10±1s max.
183