SPPJ2_15 Datasheet, PDF (4/4 Pages) ALPS ELECTRIC CO.,LTD. – 2.5mm-travel Horizontal Type

Push Switches Soldering Conditions
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple φ 0.1 to 0.2 CA (K) or CC (T) at soldering portion (copper foil surface).
A heat resisting tape should be used for fixed measurement.
3. Temperature profile
300
200
100
Room
temperature
Pre-heating
F max.
A max.
B
D
E
Time (s)
C
Series（Reflow type）
SPEG
SPEJ
SPEF
SPEH
A（℃）
3s max.
260
B（℃）
230
C（s）
40
D（℃）
E（℃）
180
150
F（s）
120
Notes
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's
　 temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc.
The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.
Reference for Hand Soldering
Series
SPPJ3, SPPJ2, SPUN, SPPH4, SPPH1
SPED2, SPED4
SPEJ
SPEG, SPEF
SPEH, SPPH2
SPUJ
Soldering temperature
350±10℃
350±10℃
350±10℃
350±5℃
350℃ max.
300±10℃
Soldering time
3+1/0s
3±0.5s
4s max.
3s max.
3s max.
3+1/0s
Reference for Dip Soldering
(For PC board terminal types)
Series
SPPJ3
SPUN
SPUJ, SPPH2, SPPH4
SPPJ2, SPPH1, SPED2, SPED4, SPEF
For PC board　端子タイプに適用
Items
Preheating temperature Preheating time
100℃ max.
60s max.
100℃ max.
60s max.
—
—
Dip soldering
Soldering temperature Duration of immersion
260±5℃
5±1s
260±5℃
10±1s
260±5℃
5±1s
260±5℃
10±1s
138