SRGP40 Datasheet, PDF (3/3 Pages) ALPS ELECTRIC CO.,LTD. – Low-profile and Hollow Shaft Surface Mount Type

Hollow Shaft Type Devices
Soldering Conditions
Hollow Shaft
Type Devices
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2П CAʢKʣor CCʢTʣat soldering portionʢcopper foil surfaceʣ. A heat resisting tape
should be used for fixed measurement.
3. Temperature profile
300
200
100
Room
temperature
Pre-heating
F max.
A max.
B
D
E
Time (s)
C
Encoder
Type
Potentiometer
Type
Serieʢ s Reflow typeʣ
SRGP30
SRGP40
Aʢˆʣ
Max
240
260
Bʢˆʣ
230
Cʢsʣ
20
40
Dʢˆʣ
150
180
Eʢˆʣ
150
Fʢsʣ
120
Notes
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where
the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size,
thickness, etc. The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. You are requested to verify the soldering
conditions thoroughly beforehand.
454