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SKPM_15 Datasheet, PDF (3/3 Pages) ALPS ELECTRIC CO.,LTD. – Low Contact Resistance (Surface Mount Type) | |||
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TACT SwitchTM Soldering Conditions
Condition for Reflow
Available for Surface Mount Type.
1. Temperature measurement: Thermocouple Ï 0.1 to 0.2 CAï¼Kï¼or CCï¼Tï¼at solder joints
ãï¼copper foil surfaceï¼.
A heat resistive tape should be used to fix thermocouple.
2. Temperature profile
Temperature (ËC )
180
150
260ËC max. 3 sec max.
230ËC
120 sec max.
ʢpre-heatingʣ
3 to 4min.
Time inside soldering equipment
Time
40s max.
Notes
1. The above temperature shall be measured of the top of switch. There are cases where the PC board's temperature greatly
differs from that of the switch, depending on the material, size, thickness of PC boards and others.
ã The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines.
Prior verification of soldering condition is highly recommended.
Conditions for Auto-dip
Available for Snap-in Type and Radial Type.
Items
Condition
Flux built-up
Mounting surface should not be exposed to flux
Preheating temperature Ambient temperature of the soldered surface of PC board. 100â max.
Preheating time
60sãmax.
Soldering temperature
260â max.
Duration of immersion
5s max.
Number of soldering
2times max.
SKHH, SKPD Series
Items
Condition
Flux built-up
Mounting surface should not be exposed to flux
Preheating temperature Ambient temperature of the soldered surface of PC board. 110â max.
Preheating time
60sãmax.
Soldering temperature
260â max.
Duration of immersion
5s max.
Number of soldering
2times max.
Manual Soldering
Items
Soldering temperature
Duration of soldering
Capacity of soldering iron
Condition
350â max.
3s max.
60W max.
SKHH, SKHW, SKRG, SKPD Series
Items
Condition
Soldering temperature
360â max.
Duration of soldering
3s max.
Capacity of soldering iron
60W max.
SKTD, SKTG, SKQJ, SKQK, SKEG Series
Items
Condition
Soldering temperature
350â max.
Duration of soldering
3s max.
Capacity of soldering iron
20W max.
SKQJ, SKQK, SKEG Series
Items
Condition
Flux built-up
Mounting surface should not be exposed to flux
Preheating temperature Ambient temperature of the soldered surface of PC board. 100â max.
Preheating time
45sãmax.
Soldering temperature
255â max.
Duration of immersion
5s max.
Number of soldering
2times max.
Notes
1. Prevent flux penetration from the top side of the TACT SwitchTM.
2. Switch terminals and a PC board should not be coated with flux prior to soldering.
3. The second soldering should be done after the switch is stable with normal temperature.
4. Use the flux with a specific gravity of min 0.81.
ï¼EC-19S-8 by TAMURA Corporation, or equivalents.ï¼
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