AA028N1-99 Datasheet, PDF (4/4 Pages) Alpha Industries – 23-30 GHz Low Noise Amplifier

23–30 GHz Low Noise Amplifier
AA028N1-99
Co-Planar Millimeterwave Package
Handling/Mounting
Co-planar packages (Figure 1) require careful mounting
design to maintain optimal performance and to minimize
VSWR interactions. A connection to the ground pads on
either side of the RF line is optional and will depend on
the type of material and geometry of the interface at the
RF ports.
Handling
In general the co-planar ceramic package is quite rugged.
However, due to ceramic’s brittle nature one should
exercise care when handling with metal tools. Do not apply
heavy pressure to the lid. Vacuum tools may be used to
pick and place this part.
The Cu-Mo-Cu base of this package is very durable,
however, care should be exercised when attaching with
screw hardware on packages which come with screw
holes. Over-tightening of screws could deform the base,
which could cause cracks in the ceramic walls. Only
personnel trained in both ESD precautions, and handling
precautions should be allowed to handle these packages.
Microstrip Mounting
An example of a co-planar microstrip launch is illustrated
in Figure 2 using an equal height dielectric material. A hole
is cut into the circuit board to allow the package to be
mounted directly to the circuit ground plane. The hole
should be cut as close to the outer dimensions of the
package to minimize RF gap distances.
It is preferred to match (mirror) the geometry of the
package interface to achieve best results. Three
5 x 1/4 mil ribbon bonds will complete the connection
providing a minimum discontinuity connection. Multiple
bondwires are also acceptable.
Surface Mounting
Mounting of the package to the surface (Figure 3) of a
circuit can be accomplished by using a series of via holes
to provide ground for the package. Although, this method
is not preferred it can be done if careful design practices
are used. Via spacing and size may have a strong effect
on high frequency performance of the package.
Package Attachment
The package can be conductive epoxy attached to its
mounting surface using either a paste or film media. SnPb
eutectic attachment can also be used in situations were
heat removal is important. Some packages allow for
hardware mounting. Care should be taken to ensure good
ground contact is maintained.
RF/DC Bondwire Attachment
Standard thermosonic ball or ribbon attachment is used
to make the connections to the RF and DC interfaces.
When designing the layout, be aware that most bonding
machines have a limited reach and may require special
tooling to wire/ribbon bond in center of a large circuit.
RF In
RF Out
RF In
RF Out
Figure 1. Co-Planar Packages
Package
Launch
Circuit
Board
Figure 2. Microstrip Mount
Package
Circuit
Board
Figure 3. Surface Mount
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Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email [e-mail] • www.alphaind.com
Specifications subject to change without notice. 10/99A