AMG-SM101 Datasheet, PDF (13/17 Pages) alpha microelectronics gmbh – Inductive Proximity Sensor IC

AMG-SM101
Inductive Proximity Sensor IC
9.3. Thermal Considerations
The SM101's QFN24 package has limited power dissipation capabilities. In case the ambient
temperature is rising above 78°C, the package requires extra cooling to prevent the junction
temperature to rise above specified limits.
Such cooling can be achieved by having a GND layer in the PCB and connecting that with
vias to the center pad of the QFN24.
Such cooling can be calculated, but as a rule of thumb, a 150mm² GND area under the IC,
connecting to the center pad with 16 vias will provide for sufficient cooling. If 150mm² cooling
area cannot be achieved, one should try to create star type traces originating from the center
pad location to the rim of the PCB. This will work as heat pipes.
9.4. Surge Protection
Depending on the necessary surge protection class, surge protection diodes and low pass
filter schemes might be necessary to protect the Vcc and OutN pins.
For more information please refer to AMG-AN-SM101.
10. Ordering Information
AMG-SM101-IQN24R
(QFN24
shipment in tape & reel)
AMG-SM101 Revision: B
06.11.12
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