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3977 Datasheet, PDF (7/18 Pages) Allegro MicroSystems – MICROSTEPPING DMOS DRIVER WITH TRANSLATOR
3977
MICROSTEPPING DMOS DRIVER
WITH TRANSLATOR
Functional Description (cont’d)
Fixed Off-Time. The internal PWM current-control
circuitry uses a one shot to control the time the driver(s)
remain(s) off. The one shot off-time, toff, is determined by
the selection of an external resistor (RT) and capacitor
(CT) connected from the RC timing terminal to ground.
The off time, over a range of values of CT = 470 pF to
1500 pF and RT = 12 kΩ to 100 kΩ is approximated by:
toff = RTCT
RC Blanking. In addition to the fixed off time of the
PWM control circuit, the CT component sets the compara-
tor blanking time. This function blanks the output of the
current-sense comparator when the outputs are switched
by the internal current-control circuitry. The comparator
output is blanked to prevent false over-current detection
due to reverse recovery currents of the clamp diodes, and/
or switching transients related to the capacitance of the
load. The blank time tBLANK can be approximated by:
tBLANK = 1400CT
Charge Pump. (CP1 and CP2). The charge pump is
used to generate a gate supply greater than VBB to drive
the source-side DMOS gates. A 0.22 µF ceramic capaci-
tor should be connected between CP1 and CP2 for pump-
ing purposes. A 0.22 µF ceramic capacitor is required
between VCP and VBB to act as a reservoir to operate the
high-side DMOS devices.
VREG. This internally generated voltage is used to operate
the sink-side DMOS outputs. The VREG terminal should
be decoupled with a 0.22 µF capacitor to ground. VREG is
internally monitored and in the case of a fault condition,
the outputs of the device are disabled.
Enable Input (ENABLE). This active-low input
enables all of the DMOS outputs. When logic high the
outputs are disabled. Inputs to the translator (STEP,
DIRECTION, MS1, MS2) are all active independent of the
ENABLE input state.
Shutdown. In the event of a fault (excessive junction
temperature, or low voltage on VCP) the outputs of the
device are disabled until the fault condition is removed.
At power up, and in the event of low VDD, the under-
voltage lockout (UVLO) circuit disables the drivers and
resets the translator to the HOME state.
Sleep Mode (SLEEP). An active-low control input
used to minimize power consumption when not in use.
This disables much of the internal circuitry including the
output DMOS, regulator, and charge pump. A logic high
allows normal operation and startup of the device in the
home position. When coming out of sleep mode, wait
1 ms before issuing a STEP command to allow the charge
pump (gate drive) to stabilize.
Percent Fast Decay Input (PFD). When a STEP
input signal commands a lower output current from the
previous step, it switches the output current decay to either
slow-, fast-, or mixed-decay depending on the voltage
level at the PFD input. If the voltage at the PFD input is
greater than 0.6VDD then slow-decay mode is selected. If
the voltage on the PFD input is less than 0.21VDD then
fast-decay mode is selected. Mixed decay is between
these two levels. This terminal should be decoupled with
a 0.1 µF capacitor.
Mixed Decay Operation. If the voltage on the PFD
input is between 0.6VDD and 0.21VDD, the bridge will
operate in mixed-decay mode depending on the step
sequence (see figures). As the trip point is reached, the
device will go into fast-decay mode until the voltage on
the RC terminal decays to the voltage applied to the PFD
terminal. The time that the device operates in fast decay is
approximated by:
tFD = RTCTIn (0.6VDD/VPFD)
After this fast decay portion, tFD, the device will
switch to slow-decay mode for the remainder of the fixed
off-time period.
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