2993 Datasheet, PDF (1/8 Pages) Allegro MicroSystems – DUAL H-BRIDGE MOTOR DRIVERS

2993
DUAL H-BRIDGE
MOTOR DRIVERS
2993
DUAL H-BRIDGE MOTOR DRIVERS
Cost-effective monolithic drive electronics for bipolar stepper and
UDN2993B
LOAD SUPPLY 1 ^VBB
T _{ENABLEA 2}
C _{PHASEA 3}
U _{GROUND 4}
Y _{GROUND 5}
D _{L OUT1A 6}
O OUT_2A 7
PR ^{ON VEA 8}
V_{DD 16 LOGIC SUPPLY}
15 ENABLE _B
14 PHASE _B
13 GROUND
12 GROUND
11 OUT1B
10 OUT_2B
9 V_EB
Dwg. No. A-12,455
UED _{ENCE ABSOLUTE MAXIMUM RATINGS}
N at T_J ≤ +150°C
I ^R _{Load Supply Voltage, VBB .................... 30 V}
T ^E _{Logic Supply Voltage, VDD ................... 7.0 V}
F _{Logic Input Voltage Range, VPHASE or}
N _{VENABLE ............... -0.3 V to VDD + 0.3 V}
E _{Output Current, IOUT ..................... ±600 mA}
O _{R Sink Driver Emitter Voltage,}
V_E .................................................. 1.5 V
C _{Package Power Dissipation,}
S ^R _{PD ........................................ See Graph}
I _{Operating Temperature Range,}
O _{TA ................................. -20°C to +85°C}
D _{F Storage Temperature Range,}
dc (brush) servo motors to 30 V and 500 mA is very practical with the
UDN2993B and UDN2993LB. These dual full-bridge motion control
ICs integrate separate inputs, level shifting for upper power outputs,
control logic, integral inductive transient protection, and source (upper)
and sink (lower) drivers in an H-bridge configuration. The single-chip
power IC provides improved space utilization and reliability unmatched
by discrete component circuitry.
Excepting the power supply connections, the two H-bridges are
independent. An ENABLE input is provided for each bridge and
permits pulse-width modulation (PWM) through the use of external
circuitry. PWM drive techniques provide the benefits of reduced power
dissipation, improved motor performance (especially torque), and
positively affect system efficiency. Separate PHASE inputs for each
bridge determine the direction of current flow in the load. Additionally,
each pair of (sink) emitters are terminated to package connections.
This allows the use of current-sensing circuitry. Both devices
incorporate an intrinsic “dead time” to preclude high crossover
(or cross-conduction) currents during changes in direction (phase).
These devices are packaged in plastic DIPs (suffix B) or surface-
mountable wide-body SOICs (suffix LB) with copper lead frames for
optimum power dissipation without heat sinks. The lead configurations
allow automatic insertion, fit standard IC sockets or printed wiring
board layouts, and enable easy attachment of a heat sink for maximum
power-handling capability. The heat-sink tabs are at ground potential
and require no insulation.
Dual full-bridge drivers with peak current ratings of ±3 A are
supplied as the UDN2998W.
FEATURES
s ±600 mA Output Current
s Output Voltage to 30 V
s Crossover Current Protection
s TTL/NMOS/CMOS Compatible Inputs
— ^{TS ............................... -55°C to +150°C}
IMPORTANT: Load supply voltage must never be
applied without logic supply voltage present.
s Low Input Current
s Internal Clamp Diodes
s Automotive Capable
NOTE: Output current rating may be limited by
Always order by complete part number:
chopping frequency, ambient temperature,
airflow, and heat sinking. Under any set of
Part Number Package
conditions, do not exceed the specified maximum
current and a junction temperature of +150°C.
UDN2993B
16-Pin DIP
UDN2993LB 20-Lead Wide-Body SOIC