AK4962ECB Datasheet, PDF (4/7 Pages) Asahi Kasei Microsystems – Low-Power CODEC with Audio/Voice DSP

[AK4962]
4. Package
■ Outline Dimensions
125-pin CSP package (4.576 x 5.224 mm, 0.4 mm (Min.) pitch)
Top View
Bottom View
5.224 ± 0.03
4.49
B
A
11
10
9
8
7
6
5
4
3
2
1
ABCDE F
GH J KLM
CDE E
C
11
10
9
8
7
6
5
4
3
2
1
ML K J
HG
0.4
0.49
FE D C B A
0.245
125  0.204~0.264
 0.015 M C A B
0.03 C
*The pin pitch is 0.4mm except between G and F. The pin pitch between G and F is 0.49 mm.
■ Material & Lead finish
Package molding compound: Epoxy, Halogen (bromine and chlorine) free
Solder ball material:
SnAgCuNi
015017325-E-01-PB
-4-
2016/02