AK9752AE Datasheet, PDF (34/36 Pages) Asahi Kasei Microsystems – Ultra-small IR sensor IC with IC

18.2. Pad dimensions
(Unit: mm)
hole for FOV
(Do not use metal plating inside this hole.)
0.50
0.688
0.65
0.65
0.20
2.70
[AK9752]
Note: ・The exposed pad in the device center should not be soldered on the board.
・It is necessary to make one hole through the board for FOV.
Do Not use metal plating inside this hole.
・Please refer to AKM document ‘AK9752_PCB_Design_Guide’ for the design.
・The exposed pad is connected to VSS pad in the package. Do not place wiring
under the package so as to insulate the exposed pad from wiring.
Exposed pad
< Device >
< Board >
Do not place wiring under the package.
Figure 18.2. AK9752 pad dimensions
016016473-E-00
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2017/1