AK4554 Datasheet, PDF (15/17 Pages) Asahi Kasei Microsystems – Low Power & Small Package 16bit ΔΣ CODEC

ASAHI KASEI
PACKAGE
16pin TSSOP (Unit: mm)
*5.0±0.1
16
9
A
[AK4554]
1.05±0.05
1
0.13 M
0.22±0.1
8
0.65
Detail A
0.17±0.05
0.1±0.1
Seating Plane
0.10
NOTE: Dimension "*" does not include mold flash.
„ Package & Lead frame material
Package molding compound:
Lead frame material:
Lead frame surface treatment:
Epoxy
Cu
Solder (Pb free) plate
0-10°
MS0325-E-01
- 15 -
2005/08