AIC1731 Datasheet, PDF (10/10 Pages) Analog Intergrations Corporation – 300mA, Low Dropout Linear Regulator with Shutdown

AIC1731
Where T_J-T_A is the temperature difference
between the die junction and the surrounding air,
Rθ_JB is the thermal resistance of the package,
and Rθ_BA is the thermal resistance through the
PCB, copper traces, and other materials to the
surrounding air.
As a general rule, the lower temperature is, the
better reliability of the device is. So the PCB
mounting pad should provide maximum thermal
conductivity to maintain low device temperature.
GND pin performs a dual function of providing
an electrical connection to ground and
channeling heat away. Therefore, connecting
the GND pin to ground with a large pad or
ground plane would increase the power
dissipation and reduce the device temperature
PHYSICAL DIMENSIONS
SOT-23-5 (unit: mm)
D
E _E1
e
e1
L
L1
0.25
c
θ
A2
b
A
A1
SYMBOL
A
A1
A2
b
c
D
E
E1
e
e1
L
L1
θ
MIN
MAX
0.95
1.45
0.05
0.15
0.90
1.30
0.30
0.50
0.08
0.22
2.80
3.00
2.60
3.00
1.50
1.70
0.95 BSC
1.90 BSC
0.30
0.60
0.60 REF
0°
8°
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