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UT8SF2M40 Datasheet, PDF (7/23 Pages) Aeroflex Circuit Technology – UT8SF2M40 80Megabit Flow-thru SSRAM
Changing Clock Frequencies
The CLK input frequency should be established at a power on,
and may only be changed while in SLEEP mode (reference
Table 6).
External Connections
A precision 25kohm < +0.2% low TCR < 25ppm/oC resistor is
required to be connected between device pin EXTRES (R15)
and VSS.
In order to ensure proper operation in conjunction with JTAG
boundary scan (reference applications note MEM-AN-005),
Aeroflex requires that specific package pins be biased through
soft connections to either VDDQ or VSSQ. Table 5 is a list of
these required external biases.
Table 5. External Bias Conditions
Signal Name
NUIL1
NUIH2
TDO
TCK
Package Pin
H1, H20, N1, N2,
N19, N20, P13,
R7, R8, R10, R12,
R13, R14, R16
P16, R8
R5
R9
DQ[47:0]3
ref Table 7
Bias Condition
>10kΩ to VSSQ
>10kΩ to VDDQ
>10kΩ to VDDQ
>10kΩ to VSSQ
>10kΩ to VDDQ or
VSSQ
Notes:
1. NUIL = Not Used Input Low
2. NUIH = Not Used Input High
3. Aeroflex recommends connecting all DQ[47:0] to either VDDQ or VSSQ
through >10kΩ resistors.
Operation
Standby Mode
Continue Deselect
Read Cycle (Start Burst)
Read Cycle (Cont. Burst)
NOP/Dummy Read
(Start)
NOP/Dummy Read
(Cont.)
Write Cycle (Start Burst)
Write Cycle (Cont. Burst)
Dummy Write (Start)
Dummy Write (Cont.
Burst)
Clock Inhibit (Stall)
Sleep Mode
Shutdown Mode
Table 6: Truth Table for UT8SF2M40[1,2,3,4,5,6,7]
Address
Used
CSx*
ZZ
SHUT
DOWN
ADV_LD
WE
BWEx
None
HL
L
L
X
X
None
XL
L
H
X
X
External
LL
L
L
H
X
Next
XL
L
H
X
X
External
LL
L
L
H
X
OE CEN CLK DQs
X L L-H 3-State
X L L-H 3-State
L L L-H Data Out
L L L-H Data Out
H L L-H 3-State
Next
XL
L
H
X
X
H L L-H 3-State
External
LL
L
Next
XL
L
None
LL
L
Next
XL
L
L
L
L
X L L-H Data In
H
X
L
X L L-H Data In
L
L
H
X L L-H 3-State
H
X
H
X L L-H 3-State
N/A
N/A
None
XL
L
HH
L
XX
H
X
X
X
X H L-H N/A
X
X
X
X X X 3-State
X
X
X
X X X 3-State
Notes:
* All chip selects active when L, at least one chip select inactive when H
1. X = “Don't Care”, H = Logic HIGH, L = Logic LOW.
2. Write is defined by WE and BWEx
3. When a Write cycle is detected, all I/Os are tri-stated.
4. The DQ pins are controlled by the current cycle and the OE signal.
5. CEN = H inserts wait states.
6. Device will power-up deselected and the I/Os in a tri-state condition, regardless of OE.
7. OE is asynchronous and is not sampled with the clock rise. It is masked internally
during Write cycles. During a Read cycle DQs = tri-state when OE is inactive or when
the device is deselected and DQs = data when OE is active.
36-00-01-005
Ver. 1.0.0
7
Aeroflex Microelectronics Solutions - HiRel