ARF1518 Datasheet, PDF (2/3 Pages) Advanced Power Technology – RF POWER MOSFET

DYNAMIC CHARACTERISTICS
Symbol Characteristic
C_iss
C_oss
C_rss
t_d(on)
t_r
t_d(off)
t_f
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Test Conditions
V_GS = 0V
V_DS = 200V
f = 1 MHz
V_GS = 15V
V_DD = 500V
I_D = 30A @ 25°C
R_G = 1.6 Ω
ARF1518
MIN TYP MAX UNIT
5400 6500
300 400
pF
125 160
8
5
ns
25
13
FUNCTIONAL CHARACTERISTICS
Symbol Characteristic
Test Conditions
MIN TYP MAX UNIT
G_{PS Common Source Amplifier Power Gain}
η
Drain Efficiency
ψ
Electrical Ruggedness VSWR 10:1
f = 27.12 MHz
V_GS = 0V V_DD = 250V
P_out = 750W
15
17
dB
70
75
%
No Degradation in Output Power
1 _{Pulse Test: Pulse width < 380 µS, Duty Cycle < 2%.}
APT Reserves the right to change, without notice, the specifications and information contained herein.
F (MHz)
2.0
13.5
27
40
Table 1 - Typical Class AB Large Signal Impedance -- ARF1501
Zin (Ω)
10.6 -j 12.2
0.5 -j 2.7
0.22 -j 2.7
0.2 +j .12
Z_OL (Ω)
31 -j 4.7
15.6 -j 16
6.2 -j 12.6
3.1 -j 9.4
Zin - Gate shunted with 25Ω I_DQ = 100mA
Z_OL - Conjugate of optimum load for 750 Watts
output at Vdd = 250V
Thermal Considerations and Package
Mounting:
The rated 1350W power dissipation is only
available when the package mounting surface is
at 25°C and the junction temperature is 200°C.
The thermal resistance between junctions and
case mounting surface is 0.12°C/W. When instal-
led, an additional thermal impedance of 0.1°C/W
between the package base and the mounting sur-
face is typical. Insure that the mounting surface
is smooth and flat. Thermal joint compound
must be used to reduce the effects of small sur-
face irregularities. The heatsink should incorpo-
rate a copper heat spreader to obtain best re-
sults. Use 4-40 or M3 screws torqued to 1.2 Nm.
.250
.250
.125d
HAZARDOUS MATERIAL WARNING
The ceramic portion of the device between
leads and mounting surface is beryllium oxide-
BeO. Beryllium oxide dust is toxic when in-
haled. Care must be taken during handling
and mounting to avoid damage to this area
These devices must never be thrown away
with general industrial or domestic waste.
.466
.150r .500
ARF1518
BeO 1525-100
.750
1.000
1.250
1.500
.500
.300
.200
.005 .040
D
G
S
1
2
3
4
1 Drain
2 Source
3 Source
4 Gate