ARF1510 Datasheet, PDF (2/2 Pages) Advanced Power Technology – RF POWER MOSFET

DYNAMIC CHARACTERISTICS
Symbol Characteristic
C_iss
C_oss
C_rss
t_d(on)
t_r
t_d(off)
t_f
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Test Conditions
V_GS = 0V
V_DS = 200V
f = 1 MHz
V_GS = 15V
V_DD = 500V
I_D = 6.5A @ 25°C
R_G = 1.6 Ω
ARF1510
MIN TYP MAX UNIT
1200 1800
100 130
pF
20
26
8
5
ns
18
10
FUNCTIONAL CHARACTERISTICS
Symbol Characteristic
G_{PS Common Source Amplifier Power Gain}
η
Drain Efficiency
ψ
Electrical Ruggedness VSWR 6:1
Test Conditions
f = 40.7 MHz
V_GS = 0V V_DD = 400V
P_out = 750W
MIN TYP MAX UNIT
13
15
dB
75
%
No Degradation in Output Power
1 _{Pulse Test: Pulse width < 380 µS, Duty Cycle < 2%.}
APT Reserves the right to change, without notice, the specifications and information contained herein.
D1
1.065"
27.05 mm
G1
S1D2
G2
S2
.300
ARF1510
1.065"
27.05 mm
D3
G3
S3D4
G4
S4
.300
.100
.175
.100
.075
.100
.175
.100
.075
.100
D1
D3
G1
G3
S1D2
S3D4
G2
G4
S2
S4
.254
.045 .005
HAZARDOUS MATERIAL
WARNING
The ceramic portion of the device
between leads and mounting surface
is beryllium oxide, BeO. Beryllium
oxide dust is toxic when inhaled.
Care must be taken during handling
and mounting to avoid damage to
this area. These devices must never
be thrown away with general industri-
al or domestic waste.
ARF 1510
Heat Sink
Clamp
Thermal Considerations and Package Mounting:
The rated 1500W power dissipation is only available when the package mounting
surface is at 25°C and the junction temperature is 200°C. The thermal resistance
between junctions and case mounting surface is 0.12°C/W. When installed, and
additional thermal impedance of 0.08°C/W between the package base and the mounting
surface is typical. Insure that the mounting surface is smooth and flat. Thermal joint
compound must be used to reduce the effects of small surface irregularities. The heat
sink should incorporate a copper heat spreader to obtain best results.
The package is designed to be clamped to a heatsink. A clamped joint maintains
the required mounting pressure while allowing for thermal expansion of both the device
and the heat sink. A simple clamp and two 6-32 (M3.5) screw can provide the minimum
125lb required mounting force. T = 12 in-lb.