ARF1501 Datasheet, PDF (2/2 Pages) Advanced Power Technology – RF POWER MOSFET N-CHANNEL ENHANCEMENT MODE

DYNAMIC CHARACTERISTICS
Symbol Characteristic
C_iss
C_oss
C_rss
t_d(on)
t_r
t_d(off)
t_f
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Test Conditions
V_GS = 0V
V_DS = 150V
f = 1 MHz
V_GS = 15V
V_DD = 0.5 V_DSS
I_D = I_D[Cont.] @ 25°C
R_G = 1.6 Ω
ARF1501
MIN TYP MAX UNIT
3600 5900
280 520
pF
108 200
7
15
5
10
ns
23
40
12
25
FUNCTIONAL CHARACTERISTICS
Symbol Characteristic
G_{PS Common Source Amplifier Power Gain}
η
Drain Efficiency
ψ
Electrical Ruggedness VSWR 20:1
Test Conditions
f = 27.12 MHz
V_GS = 0V V_DD = 300V
P_out = 900W
MIN TYP MAX UNIT
17
19
dB
70
75
%
No Degradation in Output Power
1 _{Pulse Test: Pulse width < 380 µS, Duty Cycle < 2%.}
APT Reserves the right to change, without notice, the specifications and information contained herein.
.160
D
G
S
dims: inches
.045
.005
1.065
S
D
S _.500
ARF1500
BeO
135-05
1.065
S
G
S .500
.207
.375
.207
.105 typ.
HAZARDOUS MATERIAL
WARNING
The ceramic portion of the
device between leads and
mounting surface is beryllium
oxide. Beryllium oxide dust is
highly toxic when inhaled. Care
must be taken during handling
and mounting to avoid damage
to this area. These devices
must never be thrown away with
general industrial or domestic
waste.
Thermal Considerations and Package Mounting:
The rated 1500W power dissipation is only available when the package mounting
;y;y;y;y;y;y ARF 1500
Heat Sink
Clamp
Compliant
layer
surface is at 25˚C and the junction temperature is 200˚C. The thermal resistance
between junctions and case mounting surface is 0.12 ˚C/W. When installed, an addi-
tional thermal impedance of 0.09 ˚C/W between the package base and the mounting
surface is typical. Insure that the mounting surface is smooth and flat. Thermal joint
compound must be used to reduce the effects of small surface irregularities. The heat-
sink should incorporate a copper heat spreader to obtain best results.
The package is designed to be clamped to a heatsink. A clamped joint maintains the
required mounting pressure while allowing for thermal expansion of both the device
and the heat sink. A simple clamp, a compliant layer of plastic or rubber, and two 6-32
(M3.5) screws can provide the minimum 85 lb required mounting force. T = 6 in-lb.