English
Language : 

APT40M75JN Datasheet, PDF (2/4 Pages) Advanced Power Technology – N-CHANNEL ENHANCEMENT MODE HIGH VOLTAGE POWER MOSFETS
DYNAMIC CHARACTERISTICS
Symbol
Ciss
Coss
Crss
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge 3
Gate-Source Charge
Gate-Drain ("Miller ") Charge
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Test Conditions
VGS = 0V
VDS = 25V
f = 1 MHz
VGS = 10V
VDD = 0.5 VDSS
ID = ID [Cont.] @ 25°C
VGS = 15V
VDD = 0.5 VDSS
ID = ID [Cont.] @ 25°C
RG = 0.6Ω
APT40M75/40M90JN
MIN TYP MAX UNIT
5630 6800
1320 1950 pF
510 720
241 370
34
50
nC
117 180
16
32
31
62
ns
45
70
13
26
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Symbol Characteristic / Test Conditions
MIN TYP MAX UNIT
IS
Continuous Source Current
(Body Diode)
APT40M75JN
APT40M90JN
ISM
Pulsed Source Current 1
(Body Diode)
APT40M75JN
APT40M90JN
VSD Diode Forward Voltage 2 (VGS = 0V, IS = -ID [Cont.])
t rr
Reverse Recovery Time (IS = -ID [Cont.], dlS/dt = 100A/µs)
Q rr Reverse Recovery Charge (IS = -ID [Cont.], dlS/dt = 100A/µs)
56
51
Amps
224
204
1.8 Volts
370 740 ns
8
16
µC
PACKAGE CHARACTERISTICS
Symbol Characteristic / Test Conditions
MIN TYP MAX
LD
Internal Drain Inductance (Measured From Drain Terminal to Center of Die.)
3
LS
Internal Source Inductance (Measured From Source Terminals to Source Bond Pads)
5
VIsolation RMS Voltage (50-60 Hz Sinusoidal Waveform From Terminals to Mounting Base for 1 Min.) 2500
CIsolation Drain-to-Mounting Base Capacitance (f = 1MHz)
35
Torque Maximum Torque for Device Mounting Screws and Electrical Terminations.
13
1 Repetitive Rating: Pulse width limited by maximum junction temperature. See Transient Thermal Impedance Curve. (Fig.1)
2 Pulse Test: Pulse width < 380 µS, Duty Cycle < 2%
3 See MIL-STD-750 Method 3471
0.3
0.1
0.05
D=0.5
0.2
0.1
0.01
0.005
0.05
0.02
0.01
SINGLE PULSE
Note:
t1
t2
Duty Factor D = t1/t2
Peak TJ = PDM x ZθJC + TC
0.001
10-5
10-4
10-3
10-2
10-1
1.0
10
RECTANGULAR PULSE DURATION (SECONDS)
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION
UNIT
nH
Volts
pF
in-lbs