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APT4016BVFR Datasheet, PDF (2/4 Pages) Advanced Power Technology – POWER MOS V FREDFET
DYNAMIC CHARACTERISTICS
Symbol Characteristic
Ciss Input Capacitance
Coss Output Capacitance
Crss Reverse Transfer Capacitance
Qg
Total Gate Charge 3
Qgs Gate-Source Charge
Qgd Gate-Drain ("Miller ") Charge
t d(on)
tr
Turn-on Delay Time
Rise Time
td(off) Turn-off Delay Time
tf
Fall Time
Test Conditions
VGS = 0V
VDS = 25V
f = 1 MHz
VGS = 10V
VDD = 200V
ID = 27A @ 25°C
VGS = 15V
VDD = 200V
ID = 27A @ 25°C
RG = 1.6Ω
APT4016B_SVFR(G)
MIN TYP MAX UNIT
3350
510
pF
200
135
24
nC
60
11
10
ns
48
6
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Symbol
IS
ISM
VSD
dv/dt
trr
Characteristic / Test Conditions
Continuous Source Current (Body Diode)
Pulsed Source Current 1 (Body Diode)
Diode Forward Voltage 2 (VGS = 0V, IS = -27A)
Peak Diode Recovery dv/dt 5
Reverse Recovery Time
(IS = -27A, di/dt = 100A/µs)
Reverse Recovery Charge
Qrr
(IS = -27A, di/dt = 100A/µs)
IRRM
Peak Recovery Current
(IS = -27A, di/dt = 100A/µs)
Tj = 25°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
MIN TYP MAX UNIT
27
Amps
108
1.3 Volts
15 V/ns
250
ns
450
1.8
µC
6.0
14
Amps
24
THERMAL CHARACTERISTICS
Symbol Characteristic
MIN TYP MAX UNIT
RθJC
RθJA
Junction to Case
Junction to Ambient
0.45
40
°C/W
1 Repetitive Rating: Pulse width limited by maximum junction
temperature.
2 Pulse Test: Pulse width < 380 µs, Duty Cycle < 2%
3 See MIL-STD-750 Method 3471
4 Starting Tj = +25°C, L = 3.32mH, RG = 25Ω, Peak IL = 27A
5 dv/dt numbers reflect the limitations of the test circuit rather than the
device itself. IS ≤ -ID[Cont.] di/dt ≤ 700A/µs VR ≤ VDSS TJ ≤ 150°C
APT Reserves the right to change, without notice, the specifications and information contained herein.
0.5
D=0.5
0.1
0.2
0.05
0.1
0.05
0.02
0.01
0.01
Note:
t1
0.005
SINGLE PULSE
t2
Duty Factor D = t1/t2
Peak TJ = PDM x ZθJC + TC
0.001
10-5
10-4
10-3
10-2
10-1
1.0
10
RECTANGULAR PULSE DURATION (SECONDS)
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION