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AMC3202 Datasheet, PDF (3/11 Pages) ADDtek Corp – 1.5A 280kHz BOOST REGULATORS
AMC3202
Pin
Number
Pin Name
1
COMP
2
FB
3
SS
4
EN
5
VCC
6
AGND
7
PGND
8
VSW
Exposed Heat Pad
Pad (PGND)
PIN DESCRIPTION
Pin Function
Loop compensation pin. This pin is the output of the error amplifier and is used for loop
compensation. Loop compensation can be implemented by a simple RC network.
Feedback pin. Sense the output voltage and referenced to 1.276V. When the voltage at this
pin falls below 0.4V, chip switching-frequency reduces to a much lower frequency.
Soft Start pin. Left this pin floating if soft start function is not used.
Enable pin. A TTL low will shut down the chip and high enable the chip. This pin may
also be used to synchronize the part to nearly twice the base frequency. If synchronization
is not used, this pin should be either tied high or left floating for normal operation.
Input power supply pin. Supply power to the IC and should have a bypass capacitor
connected to AGND.
Analog ground. Provide a clean ground for the controller circuitry and should not be in
the path of large currents. This pin is connected to the IC substrate.
Power ground. This pin is the ground connection for the emitter of the power switching
transistor. Connection to a good ground plane is essential.
High current switch pin. Connect to the collector of the internal power switch. The open
voltage across the power switch can be as high as 40V. To minimize radiation, use a trace
as short as practical.
Heat pad. Connect to power ground. Must be soldered to electrical ground on PCB.
THERMAL DATA
Thermal Resistance from Junction to Ambient, θ JA
Junction Temperature Calculation: TJ = TA + (PD × θ JA).
The θJA numbers are guidelines for the thermal performance of the device/pc-board system.
Connect the ground pin to ground using a large pad or ground plane for better heat dissipation.
All of the above assume no ambient airflow.
Maximum Power Calculation:
PD(MAX)=
TJ(MAX) – TA(MAX)
θJA
TJ (°C): Maximum recommended junction temperature
TA (°C): Ambient temperature of the application
θJA (°OC /W): Junction-to-Ambient thermal resistance of the package, and other heat dissipating materials.
The maximum power dissipation for a single-output regulator is:
PD(MAX) = [(VIN(MAX) - VOUT(NOM))] × IOUT(NOM) + VIN(MAX) × IQ
Where:
Then
VOUT(NOM) = the nominal output voltage
IOUT(NOM) = the nominal output current, and
IQ = the quiescent current the regulator consumes at IOUT(MAX)
VIN(MAX) = the maximum input voltage
θJA = (+150 OC – TA)/PD
165°C /W
Copyright © 2006 ADDtek Corp.
3
DD074_B -- AUGUST 2006