SHA1114_15 Datasheet, PDF (7/18 Pages) Analog Devices – HIGH RELIABILIIY CONVERTERS

05/14/98
11: 53
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ANALOG DEVICES
I4J006/017
FOR REVISIONSAND APf)ROVAL SEE SHEET I
9.10
After encapsulation,
the module shall have a final electrical test,
which shall consist of being tested for, and passing, the 25°C oper-
ating parameters designated by reference numbers 1,2,
Table 3.
and 4 of
9.11
If any components, other than trim resistors, are replaced within
the module after the quality conformance inspection has commenced,
any tests already performed on the module are invalidated, and the
10.0
'10.1
OB _11.0
SO _11.1
. ^{LETE 11.1.1}
module must begin the quality conformance inspection procedure again.
.,
CALCULATED MEAN TIME BETWEEN FAILURES:
The module shall have a minimum calculated MTBF oflOO,OOO hours at
normal room ambient temperature with nominal supply voltages applied.
The MTBF shall be calculated in accordance with Handbook MIL-HDBK-
2l7A.
COMPONENTS:
Except as allowed for in paragraph 11.2 of this specification, all
components used in modules meeting this specification shall meet the
requirements of the appropriate specification(s) called out below:
CARBON RESISTORS shall meet the requirements of MIL-R-II.
11.1.2 _{METAL FILM RESISTORS shall meet the requirements of MIL-R-lO509.}
.-
11.1. 3 _{CERAMIC CAPACITORS shall meet the applicable requirements of MIL-C-}
11015 and MIL-C-20.
'
11. 1. 4 _{TANTALUM CAPACITORS shall meet the requirements of MIL-C-26655.,}
11.1. 5
MICROCIRCUITS shall be hermetically sealed and shall meet one of the
following requirements, shown in oTder of preference: 1) microcir-
cuits qualified to MIL-M-385l0, Class B, 2) microcircuits processed
to M!L-M-38SI0,
Class B. 3) microcircuits processed to the appli-
cable requirements of MIL-STD-883, Class B. Microcircuits meeting
the requirements of a lower preference are acceptable only when those
meeting the requirements of a higher preference are not available.
11.1. 6 _{DISCRETE SEMICONDUCTORS shall be hermetically sealed and meet the}
0_~I"
requirements of MIL-S-19500.
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11.1. 7
._-^{- . 11.1.8}
1_- 1'1
PRINTED CIRCUIT BOARDS shall use material meeting the requirements
of MIL-P-13949.
ENCAPSULATING COMPOUND shall meet the requirements of Thermal Shock
MIL-I-16923, and Corrosion Resistance MIL-S-23586.
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