OP193 Datasheet, PDF (6/16 Pages) Analog Devices – Precision, Micropower Operational Amplifiers

OP193/OP293/OP493
ABSOLUTE MAXIMUM RATINGS¹
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 18 V
Input Voltage² . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 18 V
Differential Input Voltage² . . . . . . . . . . . . . . . . . . . . . . . ± 18 V
Output Short-Circuit Duration to Gnd . . . . . . . . . . Indefinite
Storage Temperature Range
P, S Package . . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Operating Temperature Range
OP193/OP293/OP493E, F . . . . . . . . . . . . –40°C to +125°C
Junction Temperature Range
P, S Package . . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature Range (Soldering, 60 sec) . . . . . . . +300°C
Package Type
θ_JA3
8-Pin Plastic DIP (P)
103
8-Pin SOIC (S)
158
14-Pin Plastic DIP (P) 83
16-Pin SOL (S)
92
θ_JC
Units
43
°C/W
43
°C/W
39
°C/W
27
°C/W
NOTES
1_{Absolute maximum ratings apply to both DICE and packaged parts, unless}
otherwise noted.
2_{For supply voltages less than ± 18 V, the input voltage is limited to the supply}
voltage.
3_{θJA is specified for the worst case conditions, i.e., θJA is specified for device in socket}
for P-DIP, and θ_JA is specified for device soldered in circuit board for SOIC
package.
DICE CHARACTERISTICS
1
8
7
2
6
Model
OP193EP
OP193ES
OP193ES-REEL
OP193ES-REEL7
OP193FP
OP193FS
OP193FS-REEL
OP193FS-REEL7
OP193GBC
OP293EP
OP293ES
OP293ES-REEL
OP293ES-REEL7
OP293FP
OP293FS
OP293FS-REEL
OP293FS-REEL7
OP293GBC
OP493EP
OP493ES
OP493ES-REEL
OP493FP
OP493FS
OP493FS-REEL
OP493GBC
ORDERING GUIDE
Temperature
Range
Package
Description
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
+25°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
+25°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
+25°C
8-Pin Plastic DIP
8-Pin SOIC
8-Pin SOIC
8-Pin SOIC
8-Pin Plastic DIP
8-Pin SOIC
8-Pin SOIC
8-Pin SOIC
DICE
8-Pin Plastic DIP
8-Pin SOIC
8-Pin SOIC
8-Pin SOIC
8-Pin Plastic DIP
8-Pin SOIC
8-Pin SOIC
8-Pin SOIC
DICE
14-Pin Plastic DIP
16-Pin SOL
16-Pin SOL
14-Pin Plastic DIP
16-Pin SOL
16-Pin SOL
DICE
Package
Option
N-8
SO-8
SO-8
SO-8
N-8
SO-8
SO-8
SO-8
N-8
SO-8
SO-8
SO-8
N-8
SO-8
SO-8
SO-8
N-14
SOL-16
SOL-16
N-14
SOL-16
SOL-16
1
7
2
6
3
4
5
OP193 Die Size 0.070 × 0.055 Inch, 3,850 Sq. Mils Substrate
(Die Backside) Is Connected to V– Transistor Count, 55
1
8
7
2
6
5
3
4
OP493 Die Size 0.106 × 0.143 Inch, 15,158 Sq. Mils Substrate
(Die Backside) Is Connected to V– Transistor Count, 215
5
3
4
OP293 Die Size 0.072 × 0.110 Inch, 7,920 Sq. Mils Substrate
(Die Backside) Is Connected to V– Transistor Count, 105
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the OP193/OP293/OP493 feature proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high energy electrostatic discharges. Therefore,
proper ESD precautions are recommended to avoid performance degradation or loss of
functionality.
WARNING!
ESD SENSITIVE DEVICE
–6–
REV. A