ADUC812BSZ Datasheet, PDF (6/57 Pages) Analog Devices – MicroConverter, Multichannel 12-Bit ADC with Embedded Flash MCU

ADuC812
ABSOLUTE MAXIMUM RATINGS*
(T_A = 25°C, unless otherwise noted.)
AV_DD to DV_DD . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
DV_DD to DGND, AV_DD to AGND . . . . . . . . . –0.3 V to +7 V
Digital Input Voltage to DGND . . . –0.3 V to DV_DD + 0.3 V
Digital Output Voltage to DGND . . –0.3 V to DV_DD + 0.3 V
V_REF to AGND . . . . . . . . . . . . . . . . . –0.3 V to AV_DD + 0.3 V
Analog Inputs to AGND . . . . . . . . . . –0.3 V to AV_DD + 0.3 V
Operating Temperature Range Industrial (B Version)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
θ_JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . 90°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
52-Lead MQFP
PIN CONFIGURATIONS
56-Lead LFCSP
52 51 50 49 48 47 46 45 44 43 42 41 40
P1.0/ADC0/T2 1
P1.1/ADC1/T2EX 2
P1.2/ADC2 3
P1.3/ADC3 4
AV_DD 5
AGND 6
C_REF 7
V_REF 8
DAC0 9
DAC1 10
P1.4/ADC4 11
P1.5/ADC5/SS 12
P1.6/ADC6 13
PIN 1
IDENTIFIER
ADuC812
TOP VIEW
(Not to Scale)
39 P2.7/A15/A23
38 P2.6/A14/A22
37 P2.5/A13/A21
36 P2.4/A12/A20
35 DGND
34 DV_DD
33 XTAL2
32 XTAL1
31 P2.3/A11/A19
30 P2.2/A10/A18
29 P2.1/A9/A17
28 P2.0/A8/A16
27 SDATA/MOSI
14 15 16 17 18 19 20 21 22 23 24 25 26
P1.1/ADC1/ T2EX
P1.2/ ADC2
P1.3/ ADC3
AVDD
AVDD
AGND
AGND
AGND
CREF
VREF
DAC0
DAC1
P1.4/ ADC4
P1.5/ADC5/ SS
1
PIN 1
2 INDENTIFIER
3
4
5
6
ADuC812
7
TOP VIEW
8
(Not to Scale)
9
10
11
12
13
14
42 P2.7/A15/A23
41 P2.6/A14/A22
40 P2.5/A13/A21
39 P2.4/A12/A20
38 DGND
37 DGND
36 DVDD
35 XTAL2
34 XTAL1
33 P2.3/A11/A19
32 ^P2.2/A10/A18
31 P2.1/A9/A17
30 P2.0/A8/A16
29 SDATA/ MOSI
Exposed Pad. For the LFCSP, the exposed pad must
be soldered and left unconnected.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADuC812 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
–6–
REV. F