AD8062_15 Datasheet, PDF (6/20 Pages) Analog Devices – Low Cost, 300 MHz Rail-to-Rail Amplifiers

AD8061/AD8062/AD8063
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Supply Voltage
Internal Power Dissipation¹
8-lead SOIC (R)
5-lead SOT-23 (RJ)
6-lead SOT-23 (RJ)
8-lead MSOP (RM)
Input Voltage (Common-Mode)
Differential Input Voltage
Output Short-Circuit Duration
Storage Temperature Range
R-8, RM-8, SOT-23-5, SOT-23-6
Operating Temperature Range
Lead Temperature (Soldering,
10 sec)
Rating
8V
0.8 W
0.5 W
0.5 W
0.6 W
(−VS − 0.2 V) to (+VS + 0.2 V)
±VS
Observe power derating curves
−65°C to +125°C
−40°C to +85°C
300°C
1 _{Specification is for device in free air.}
8-Lead SOIC_N: θJA = 160°C/W; θJC = 56°C/W.
5-Lead SOT-23: θJA = 240°C/W; θJC = 92°C/W.
6-Lead SOT-23: θJA = 230°C/W; θJC = 92°C/W.
8-Lead MSOP: θJA = 200°C/W; θJC = 44°C/W.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Data Sheet
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8061/AD8062/AD8063 is limited by the associated rise in
junction temperature. The maximum safe junction temperature
for plastic encapsulated devices is determined by the glass
transition temperature of the plastic, approximately 150°C.
Temporarily exceeding this limit may cause a shift in parametric
performance due to a change in the stresses exerted on the die
by the package. Exceeding a junction temperature of 175°C for
an extended period can result in device failure. While the
AD8061/AD8062/AD8063 is internally short-circuit protected,
this may not be sufficient to guarantee that the maximum
junction temperature (150°C) is not exceeded under all
conditions.
To ensure proper operation, it is necessary to observe the
maximum power derating curves.
2.0
8-LEAD SOIC
PACKAGE
1.5
T_J = 150°C
1.0
0.5
MSOP
SOT-23-5, SOT-23-6
0
–50 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90
AMBIENT TEMPERATURE (°C)
Figure 6. Maximum Power Dissipation vs. Temperature for
AD8061/AD8062/AD8063
ESD CAUTION
Rev. J | Page 6 of 20