AD5398_15 Datasheet, PDF (6/17 Pages) Analog Devices – 120 mA, Current Sinking, 10-Bit, IC DAC

ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.¹
Table 4.
Parameter
VDD to AGND
VDD to DGND
AGND to DGND
SCL, SDA to DGND
PD to DGND
ISINK to AGND
Operating Temperature Range
Industrial (B Version)
Storage Temperature Range
Junction Temperature (TJ max)
LFCSP Power Dissipation
θJA Thermal Impedance²
Mounted on 2-Layer Board
Mounted on 4-Layer Board
Lead Temperature, Soldering
Max Peak Reflow Temperature³
Rating
–0.3 V to +7 V
–0.3 V to VDD + 0.3 V
–0.3 V to +0.3 V
–0.3 V to VDD + 0.3 V
–0.3 V to VDD + 0.3 V
–0.3 V to VDD + 0.3 V
–40°C to +85°C
–65°C to +150°C
150°C
(TJ max − TA)/θJA
84°C/W
48°C/W
260°C (±5°C)
1 _{Transient currents of up to 100 mA do not cause SCR latch-up.}
2 _{To achieve the optimum θJA, it is recommended that the AD5398 is soldered on a}
4-layer board. The AD5398 comes in an 8-lead LFCSP package with an exposed
paddle that should be connected to the same potential as the AD5398 DGND pin.
3 _{As per Jedec J-STD-020C.}
AD5398
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability. Only one absolute maximum rating may be
applied at any one time.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. B | Page 5 of 16