ADSP-BF531_07 Datasheet, PDF (57/60 Pages) Analog Devices – Blackfin® Embedded Processor

OUTLINE DIMENSIONS
Dimensions in the outline dimension figures are shown in
millimeters.
0.75
0.60
0.45
0.27
0.22
0.17
ADSP-BF531/ADSP-BF532/ADSP-BF533
176
1
PIN 1
26.00 BSC SQ
24.00 BSC SQ
133
132
SEATING
PLANE
0.08 MAX LEAD
COPLANARITY
0.15
0.05
1.45
44
89
1.40
45
88
1.35
1.60 MAX
DETAIL A
0.50 BSC
LEAD PITCH
DETAIL A
TOP VIEW (PINS DOWN)
NOTES
1. DIMENSIONS IN MILLIMETERS
2. ACTUAL POSITION OF EACH LEAD IS WITHIN 0.08 OF ITS
IDEAL POSITION, WHEN MEASURED IN THE LATERAL DIRECTION.
3. CENTER DIMENSIONS ARE NOMINAL
Figure 61. 176-Lead Low Profile Quad Flat Package (LQFP) ST-176-1
12.00 BSC SQ
BALL A1
INDICATOR
TOP VIEW
1.70
MAX
DETAIL A
10.40
BSC
SQ
1.31
1.21
1.11
14 12 10 8 6 4 2 ^{A1 CORNER}
13 11 9 7 5 3 1 INDEX AREA
A
B
C
D
E
F
G
H
J
K
L
M
N
P
0.80 BSC
BALL PITCH
BOTTOM VIEW
SEATING
PLANE _{0.40 NOM}
(NOTE 3)
NOTES
1. DIMENSIONS ARE IN MILLIMETERS.
2. COMPLIES WITH JEDEC REGISTERED OUTLINE
MO-205, VARIATION AE WITH EXCEPTION OF
THE BALL DIAMETER.
3. MINIMUM BALL HEIGHT 0.25.
0.50
0.12
0.45
MAX
0.40
COPLANARITY
BALL DIAMETER
DETAIL A
Figure 62. 160-Ball Chip Scale Package Ball Grid Array (CSP_BGA) BC-160-2
Rev. E | Page 57 of 60 | July 2007