HMC650 Datasheet, PDF (5/8 Pages) Hittite Microwave Corporation – WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz

HMC650 TO HMC658
v01.0308
WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz
HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658
Outline Drawing
HMC650, HMC652, HMC653, HMC654, HMC655, HMC656 HMC657
2
Outline Drawing
HMC651 & HMC658
Die Packaging Information ^[1]
Standard
Alternate
GP-5 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES (MILLIMETERS).
2. TYPICAL BOND PAD IS .004” SQUARE.
3. TYPICAL BOND PAD SPACING IS .006” CENTER TO
CENTER EXCEPT AS NOTED.
4. BACKSIDE METALIZATION: GOLD
5. BACKSIDE METAL IS GROUND
6. BOND PAD METALIZATION: GOLD
7. DO NOT BOND ON TOP OF GROUND VIAS
8. OVERALL DIE SIZE ±0.002”
2-6
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