HMC557A Datasheet, PDF (5/23 Pages) Analog Devices – 24-terminal ceramic leadless chip carrier package

Data Sheet
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
NIC 1
GND 2
LO 3
GND 4
NIC 5
NIC 6
HMC557A
TOP VIEW
(Not to Scale)
18 NIC
17 GND
16 RF
15 GND
14 NIC
13 NIC
HMC557A
NOTES
1. NIC = NO INTERNAL CONNECTION.
2. CONNECT THE EXPOSED PAD TO A
LOW IMPEDANCE THERMAL AND
ELECTRICAL GROUND PLANE.
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
Mnemonic Description
1, 5 to 7, 11 to NIC
14, 18 to 24
No Internal Connection. No connection is required on these pins. These pins are not internally
connected. However, all data is measured with these pins connected to RF/dc ground externally.
2, 4, 8, 10, 15, 17 GND
Ground Connect. Connect these pins and the package bottom to RF/dc ground.
3
LO
Local Oscillator Port. This pin is dc-coupled and matched to 50 Ω.
9
IF
Intermediate Frequency Port. This pin is dc-coupled. For applications not requiring operation to dc,
block this pin externally using a series capacitor with a value chosen to pass the necessary IF frequency
range. For operation to dc, this pin must not source or sink more than 2 mA of current or device
nonfunctionality or device failure may result.
16
RF
Radio Frequency Port. This pin is dc-coupled and matched to 50 Ω.
EPAD
Exposed Pad. Connect the exposed pad to a low impedance thermal and electrical ground plane.
Rev. C | Page 5 of 23