ADV3002 Datasheet, PDF (5/28 Pages) Analog Devices – 4:1 HDMI/DVI Switch with Equalization, DDC/CEC Buffers and EDID Replication

ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
AVCC to AVEE
P5V_x
AMUXVCC
Internal Power Dissipation
TMDS Single-Ended Input
Voltage
TMDS Differential Input
Voltage
Voltage at TMDS Output
DDC Input Voltage
CEC Input Voltage
I²C Logic Input Voltage
(EDID_SCL, EDID_SDA,
I2C_SCL, I2C_SDA)
Parallel Input Voltage
(I2C_ADDR[1:0],
RESETB)
Parallel Input Voltage
(SEL[1:0], TX_EN)
Storage Temperature Range
Operating Temperature
Range
Junction Temperature
ESD Protection (HBM) on
HDMI Input Pins
ESD Protection (HBM) on
All Other Pins
Rating
3.7 V
5.8 V
AVCC − 0.3 V < AMUXVCC < 5.8 V
1.2 W
AVCC − 1.4 V < VIN < AVCC + 0.3 V
2.0 V
VOUT < 3.7 V
AVEE − 0.3 V < VIN < AMUXVCC + 0.3 V
AVEE − 0.3 V < VIN < 4.0 V
AVEE − 0.3 V < VIN < 4.0 V
AVEE − 0.3 V < VIN < AMUXVCC + 0.3 V
AVEE − 0.3V < VIN < AVCC + 0.3 V
−65°C to +125°C
0°C to +85°C
150°C
±8 kV
±2.5 kV
ADV3002
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions: a device soldered
in a 4-layer JEDEC circuit board for surface-mount packages.
θJC is specified for the exposed pad soldered to the circuit board
with no airflow.
Table 5. Thermal Resistance
Package Type
θJA
θJC
Unit
80-Lead LQFP (ST-80-2)
51.3
15.3
°C/W
ESD CAUTION
Rev. 0 | Page 5 of 28