ADCLK944 Datasheet, PDF (5/12 Pages) Analog Devices – 2.5 V/3.3 V, Four LVPECL Outputs, SiGe Clock Fanout Buffer

ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Supply Voltage
VCC − VEE
Input Voltage
CLK, CLK
CLK to CLK
Input Termination, VT to CLK, CLK
Input Current, CLK, CLK to VT Pin
(CML, LVPECL Termination)
Maximum Voltage on Output Pins
Maximum Output Current
Voltage Reference (VREF)
Operating Temperature
Ambient Range
Junction
Storage Temperature Range
Rating
6.0 V
VEE − 0.5 V to VCC + 0.5 V
±1.8 V
±2 V
±40 mA
VCC + 0.5 V
35 mA
VCC to VEE
−40°C to +85°C
150°C
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ADCLK944
DETERMINING JUNCTION TEMPERATURE
To determine the junction temperature on the application
printed circuit board (PCB), use the following equation:
TJ = TCASE + (ΨJT × PD)
where:
TJ is the junction temperature (°C).
TCASE is the case temperature (°C) measured by the customer at
the top center of the package.
ΨJT is as indicated in Table 5.
PD is the power dissipation.
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first-order approx-
imation of TJ using the following equation:
TJ = TA + (θJA × PD)
where TA is the ambient temperature (°C).
Values of θJB are provided in Table 5 for package comparison
and PCB design considerations.
ESD CAUTION
THERMAL PERFORMANCE
Table 5.
Parameter
Junction-to-Ambient Thermal Resistance
Still Air
0.0 m/sec Airflow
Moving Air
1.0 m/sec Airflow
2.5 m/sec Airflow
Junction-to-Board Thermal Resistance
Moving Air
1.0 m/sec Airflow
Junction-to-Case Thermal Resistance (Die-to-Heat Sink)
Still Air
0.0 m/sec Airflow
Junction-to-Top-of-Package Characterization Parameter
Still Air
0.0 m/sec Airflow
Symbol
θJA
θJMA
Description
Per JEDEC JESD51-2
Per JEDEC JESD51-6
θJB
Per JEDEC JESD51-8
θJC
Per MIL-STD-883, Method 1012.1
ΨJT
Per JEDEC JESD51-2
Value¹
78
68
61
49
1.5
2.0
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
1 _{Results are from simulations. The PCB is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the conditions in the}
application to determine whether they are similar to those assumed in these calculations.
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