AD8619_15 Datasheet, PDF (5/16 Pages) Analog Devices – Low Cost Micropower, Low Noise CMOS

Data Sheet
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
Supply Voltage
Input Voltage
Input Current
Differential Input Voltage
Output Short-Circuit Duration to GND
Storage Temperature Range
Operating Temperature Range
Junction Temperature Range
Lead Temperature (Soldering, 60 sec)
ESD AD8613
HBM
FICDM
ESD AD8617
HBM
FICDM
MM
ESD AD8619
HBM
FICDM
MM
Rating
6V
VSS − 0.3 V to VDD + 0.3 V
±10 mA
±6 V
Indefinite
−65°C to +150°C
−40°C to +125°C
−65°C to +150°C
300°C
±4000 V
±1000 V
±3000 V
±1000 V
±100 V
±4000 V
±1250 V
±200 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
AD8613/AD8617/AD8619
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Characteristics
Package Type
θJA
5-Lead TSOT-23 (UJ-5)
207
5-Lead SC70 (KS-5)
376
8-Lead MSOP (RM-8)
210
8-Lead SOIC_N (R-8)
158
8-Lead LFCSP_VD (CP-8-9)
81
14-Lead SOIC_N (R-14)
120
14-Lead TSSOP (RU-14)
180
θJC
Unit
61
°C/W
126 °C/W
45
°C/W
43
°C/W
20
°C/W
36
°C/W
35
°C/W
ESD CAUTION
Rev. F | Page 5 of 16