ADSP-21061_15 Datasheet, PDF (46/52 Pages) Analog Devices – Commercial Grade SHARC DSP Microcomputer

ADSP-21061/ADSP-21061L
ENVIRONMENTAL CONDITIONS
Thermal Characteristics
The ADSP-21061 is available in 240-lead thermally enhanced
MQFP package. The top surface of the thermally enhanced
MQFP contains a metal slug from which most of the die heat is
dissipated. The slug is flush with the top surface of the package.
Note that the metal slug is internally connected to GND
through the device substrate.
The ADSP-21061L is available in 240-lead MQFP and 225-ball
plastic BGA packages.
All packages are specified for a case temperature (T_CASE). To
ensure that the T_CASE is not exceeded, a heatsink and/or an air-
flow source may be used. A heat sink should be attached with a
thermal adhesive.
T_CASE = T_AMB + (PD _CA)
T_CASE = Case temperature (measured on top surface of package)
T_AMB = Ambient temperature C
PD =Power dissipation in W (this value depends upon the spe-
cific application; a method for calculating PD is shown under
Power Dissipation).
_CA =Value from tables below.
Table 29. ADSP-21061 (5 V Thermally Enhanced ED/MQFP
Package)
Parameter
_CA
Condition (Linear Ft./Min.)
Airflow = 0
Airflow = 100
Airflow = 200
Airflow = 400
Airflow = 600
Typical
10
9
8
7
6
Unit
°C/W
Table 30. ADSP-21061L (3.3 V MQFP Package)
Parameter
_CA
Condition (Linear Ft./Min.)
Airflow = 0
Airflow = 100
Airflow = 200
Airflow = 400
Airflow = 600
Typical
19.6
17.6
15.6
13.9
12.2
Unit
°C/W
Table 31. ADSP-21061L (3.3 V PBGA Package)
Parameter
_CA
Condition (Linear Ft./Min.)
Airflow = 0
Airflow = 200
Airflow = 400
Typical
19.0
13.6
11.2
Unit
°C/W
Rev. D | Page 46 of 52 | May 2013