HMC582LP5 Datasheet, PDF (4/6 Pages) Hittite Microwave Corporation – MMIC VCO w/ HALF FREQUENCY OUTPUT & DIVIDE-BY-4, 11.1 - 12.4 GHz

Outline Drawing
HMC582LP5 / 582LP5E
v03.0811
MMIC VCO w/ HALF FREQUENCY OUTPUT
& DIVIDE-BY-4, 11.1 - 12.4 GHz
Package Information
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN.
Part Number
HMC582LP5
Package Body Material
Low Stress Injection Molded Plastic
Lead Finish
Sn/Pb Solder
HMC582LP5E RoHS-compliant Low Stress Injection Molded Plastic
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
100% matte Sn
MSL Rating
MSL3 ^[1]
MSL3 ^[2]
Package Marking ^[3]
H582
XXXX
H582
XXXX
Pin Descriptions
Pin Number
Function
1 - 3, 8 - 10, 13 - 18,
20, 22 - 28, 30 - 32
N/C
Description
No Connection. These pins may be connected to RF/
DC ground. Performance will not be affected.
Interface Schematic
4
RFOUT/4
Divide-by-4 output. DC block required.
8
Supply voltage for prescaler. If prescaler is not
6
Vcc (Dig)
required, this pin may be left open to conserve
approximately 65 mA of current.
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