HMC575LP4 Datasheet, PDF (4/6 Pages) Hittite Microwave Corporation – SMT GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 6 - 9 GHz OUTPUT

Outline Drawing
v00.0506
HMC575LP4 / 575LP4E
SMT GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 6 - 9 GHz OUTPUT
7
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOT FOR SUGGESTED
LAND PATTERN.
Package Information
Part Number
Package Body Material
HMC575LP4
Low Stress Injection Molded Plastic
Lead Finish
Sn/Pb Solder
HMC575LP4E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
MSL Rating
MSL1 ^[1]
MSL1 ^[2]
Package Marking ^[3]
H575
XXXX
H575
XXXX
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