HMC533LP4 Datasheet, PDF (4/6 Pages) Hittite Microwave Corporation – MMIC VCO w/ DIVIDE-BY-16, 23.8 - 24.8 GHz

Outline Drawing
v00.0405
HMC533LP4 / 533LP4E
MMIC VCO w/ DIVIDE-BY-16,
23.8 - 24.8 GHz
Package Information
NOTES:
11. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN.
Part Number
HMC533LP4
Package Body Material
Low Stress Injection Molded Plastic
Lead Finish
Sn/Pb Solder
HMC533LP4E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
MSL Rating
MSL1 ^[1]
MSL1 ^[2]
Package Marking ^[3]
H533
XXXX
H533
XXXX
12
Pin Descriptions
Pin Number
Function
1, 15, 17,
21, 23
GND
Description
Package bottom has an exposed metal paddle that
must also be connected to RF/DC ground.
2
RFOUT/16
Divided-by-16 Output
Interface Schematic
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