HMC437MS8G Datasheet, PDF (4/6 Pages) Hittite Microwave Corporation – SMT GaAs HBT MMIC DIVIDE-BY-3, DC - 7.0 GHz

Outline Drawing
HMC437MS8G / 437MS8GE
v05.1211
SMT GaAs HBT MMIC
DIVIDE-BY-3, DC - 7 GHz
4
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
5. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO
PCB RF GROUND.
Package Information
Part Number
Package Body Material
HMC437MS8G
Low Stress Injection Molded Plastic
Lead Finish
Sn/Pb Solder
HMC437MS8GE RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
MSL Rating
MSL1 ^[1]
MSL1 ^[2]
Package Marking ^[3]
H437
XXXX
H437
XXXX
Pin Description
Pin Number
Function
1
Vcc
Description
Supply voltage 5V ± 0.25V.
Interface Schematic
2
IN
RF input must be DC blocked.
3
IN
RF input 180° out of phase with pin 2 for differential
operation. AC ground for single ended operation.
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