HMC434 Datasheet, PDF (4/6 Pages) Hittite Microwave Corporation – SMT GaAs HBT MMIC DIVIDE-BY-8, DC - 8.0 GHz

v04.0410
Outline Drawing
HMC434 / 434E
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 8 GHz
4
Package Information
Part Number
Package Body Material
HMC434
Low Stress Injection Molded Plastic
HMC434E
RoHS-compliant Low Stress Injection Molded Plastic
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOT FOR SUGGESTED
LAND PATTERN.
Lead Finish
Sn/Pb Solder
100% matte Sn
MSL Rating
MSL1 ^[1]
MSL1 ^[2]
Package Marking ^[3]
H434
XXXX
434E
XXXX
Pin Description
Pin Number
Function
1, 4
N/C
2
GND
Description
The pins are not connected internally; however, all
data shown herein was measured with these pins
connected to RF/DC ground externally.
Pin must connect ro RF/DC ground.
Interface Schematic
3
IN
RF input must be DC blocked.
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