HMC432 Datasheet, PDF (4/6 Pages) Hittite Microwave Corporation – SMT GaAs HBT MMIC DIVIDE-BY-2, DC - 8.0 GHz

v04.0410
Outline Drawing
HMC432 / 432E
SMT GaAs HBT MMIC
DIVIDE-BY-2, DC - 8 GHz
4
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS].
3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
5. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
Package Information
Part Number
Package Body Material
HMC432
Low Stress Injection Molded Plastic
Lead Finish
Sn/Pb Solder
HMC432E
RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
MSL Rating
MSL1 ^[1]
MSL1 ^[2]
Package Marking ^[3]
H432
XXXX
432E
XXXX
Pin Description
Pin Number
Function
1, 4
N/C
2
GND
Description
The pins are not connected internally; however, all
data shown herein was measured with these pins
connected to RF/DC ground externally.
Pin must connect to RF/DC ground.
3
IN
RF input must be DC blocked.
Interface Schematic
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