ADT6501_15 Datasheet, PDF (4/16 Pages) Analog Devices – Low Cost, 2.7 V to 5.5 V, Micropower Temperature Switches in SOT-23

ADT6501/ADT6502/ADT6503/ADT6504
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
V_CC to GND
HYST Input Voltage to GND
Open-Drain Output Voltage to GND
Push-Pull Output Voltage to GND
Input Current on All Pins
Output Current on All Pins
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature, T_JMAX
5-Lead SOT-23 (RJ-5)
Power Dissipation¹
Thermal Impedance³
θ_JA, Junction-to-Ambient (Still Air)
IR Reflow Soldering
(RoHS Compliant Package)
Peak Temperature
Time at Peak Temperature
Ramp-Up Rate
Ramp-Down Rate
Time 25°C to Peak Temperature
Rating
−0.3 V to +7 V
−0.3 V to V_CC + 0.3 V
−0.3 V to +7 V
−0.3 V to V_CC + 0.3 V
20 mA
20 mA
−55°C to +125°C
−65°C to +160°C
150.7°C
W_MAX = (T_JMAX − T_A2)/θ_JA
240°C/W
260°C (+0°C)
20 sec to 40 sec
3°C/sec maximum
−6°C/sec maximum
8 minute maximum
1 _{Values relate to package being used on a standard 2-layer PCB. This gives a}
worst case θ_JA. Refer to Figure 2 for a plot of maximum power dissipation vs.
ambient temperature (T_A).
2 _{TA = ambient temperature.}
3 _{Junction-to-case resistance is applicable to components featuring a}
preferential flow direction, for example, components mounted on a
heat sink. Junction-to-ambient resistance is more useful for air-cooled,
PCB-mounted components.
Data Sheet
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
SOT-23 PD @ 125°C = 0.107W
0
–55 –40 –20 0 20 40 60 80 100 120
–50 –30 –10 10 30 50 70 90 110 125
TEMPERATURE (°C)
Figure 2. SOT-23 Maximum Power Dissipation vs. Temperature
ESD CAUTION
Rev. B | Page 4 of 16