AD669BRZ Datasheet, PDF (4/12 Pages) Analog Devices – Monolithic 16-Bit DACPORT

AD669
ESD SENSITIVITY
The AD669 features input protection circuitry consisting of large transistors and polysilicon series
resistors to dissipate both high-energy discharges (Human Body Model) and fast, low-energy pulses
(Charged Device Model). Per Method 3015.2 of MIL-STD-883: C, the AD669 has been classified
as a Class 2 device.
Proper ESD precautions are strongly recommended to avoid functional damage or performance
degradation. Charges as high as 4000 volts readily accumulate on the human body and test
equipment and discharge without detection. Unused devices must be stored in conductive foam or
shunts, and the foam should be discharged to the destination socket before devices are removed.
For further information on ESD precautions, refer to Analog Devices’ ESD Prevention Manual.
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS^*
V_CC to AGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +17.0 V
V_EE to AGND . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –17.0 V
V_LL to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 1 V
Digital Inputs (Pins 5 through 23) to DGND . . . . . . –1.0 V to
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.0 V
REF IN to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 10.5 V
Span/Bipolar Offset to AGND . . . . . . . . . . . . . . . . . . . ± 10.5 V
REF OUT, V_OUT . . . . . . Indefinite Short To AGND, DGND,
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V_CC, V_EE, and V_LL
Power Dissipation (Any Package)
To +60°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000 mW
Derates above +60°C . . . . . . . . . . . . . . . . . . . . . .8.7 mW/°C
Storage Temperature . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . . +300°C
*Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only, and functional
operation of the device at these or any other conditions above those indicated in
the operational section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ORDERING GUIDE
PIN CONFIGURATION
V_EE 1
V_{CC 2}
V_LL 3
DGND 4
L1 5
CS 6
DB15 7
DB14 8
DB13 9
DB12 10
DB11 11
DB10 12
DB9 13
DB8 14
AD669
TOP VIEW
(Not to Scale)
28 REF OUT
27 REF IN
26
SPAN/BIP
OFFSET
25 VOUT
24 AGND
23 LDAC
22 DB0
21 DB1
20 DB2
19 DB3
18 DB4
17 DB5
16 DB6
15 DB7
Model
AD669AN
AD669AR
AD669BN
AD669BR
AD669AQ
AD669BQ
AD669SQ
AD669/883B**
Temperature
Range
Linearity
Error Max
T_MIN–T_MAX
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–55°C to +125°C
–55°C to +125°C
± 4 LSB
± 4 LSB
± 2 LSB
± 2 LSB
± 4 LSB
± 2 LSB
± 4 LSB
**
Gain
TC max
ppm/؇C
25
25
15
15
15
15
15
**
Package
Description
Plastic DIP
SOIC
Plastic DIP
SOIC
Cerdip
Cerdip
Cerdip
**
Package
Option*
N-28
R-28
N-28
R-28
Q-28
Q-28
Q-28
**
** N = Plastic DIP; Q = Cerdip; R = SOIC.
** Refer to AD669/883B military data sheet.
10
–60dB
1
10
–60dB
1
0.1
–20dB
0.01
0dB
0.001
–50 –25
0
25 50 75 100 125
TEMPERATURE – °C
THD+N vs. Temperature
–4–
0.1
–20dB
0.01
0dB
0.001
100
1000
FREQUENCY – Hz
10000
THD+N vs. Frequency
REV. A