AD9364 Datasheet, PDF (32/33 Pages) Analog Devices – Point to point communication systems

Data Sheet
PACKAGING AND ORDERING INFORMATION
OUTLINE DIMENSIONS
A1 BALL
CORNER
10.10
10.00 SQ
9.90
1.70 MAX
TOP VIEW
DETAIL A
8.80 SQ
0.80
0.60
REF
12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
BOTTOM VIEW
A1 BALL
CORNER
DETAIL A
1.00 MIN
0.32 MIN
AD9364
SEATING
PLANE
0.50
COPLANARITY
0.45
0.12
0.40
BALL DIAMETER
COMPLIANT TO JEDEC STANDARDS MO-275-EEAB-1.
Figure 76. 144-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-144-7)
Dimensions shown in millimeters
ORDERING GUIDE
Model¹
AD9364BBCZ
AD9364BBCZREEL
1 _{Z = RoHS Compliant Part.}
Temperature Range
−40°C to +85°C
−40°C to +85°C
Package Description
144-Ball CSP_BGA
144-Ball CSP_BGA
Package Option
BC-144-7
BC-144-7
Rev. C | Page 31 of 32