HMC494LP3 Datasheet, PDF (3/6 Pages) Hittite Microwave Corporation – SMT GaAs HBT MMIC DIVIDE-BY-8, DC - 18 GHz

HMC494LP3 / 494LP3E
v05.1211
SMT GaAs HBT MMIC
DIVIDE-BY-8, DC - 18 GHz
Output Voltage Waveform,
Pin= 0 dBm, Fout= 882 MHz, T= 25 °C
4
500
300
Absolute Maximum Ratings
RF Input (Vcc = +5V)
Supply Voltage (Vcc1, Vcc2)
Channel Temperature (Tc)
+13 dBm
+5.5V
135 °C
100
Continuous Pdiss (T = 85 °C)
(derate 11.9 mW/° C above 85 °C)
593 mW
-100
Thermal Resistance (R_TH)
(junction to ground paddle)
84 °C/W
Storage Temperature
-65 to +150 °C
-300
Operating Temperature
-40 to +85 °C
-500
22.7
23.1
23.5
23.9
24.3
24.7
TIME (nS)
ESD Sensitivity (HBM)
Class 1A
Typical Supply Current vs. Vcc
Vcc1, Vcc2 (V)
Icc (mA)
ELECTROSTATIC SENSITIVE DEVICE
4.75
90
OBSERVE HANDLING PRECAUTIONS
5.0
103
5.25
115
Note: Divider will operate over full voltage range shown above
Outline Drawing
4-3
Package Information
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
LAND PATTERN.
Part Number
HMC494LP3
Package Body Material
Low Stress Injection Molded Plastic
Lead Finish
Sn/Pb Solder
HMC494LP3E RoHS-compliant Low Stress Injection Molded Plastic
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
100% matte Sn
MSL Rating
MSL1 ^[1]
MSL1 ^[2]
Package Marking ^[3]
494
XXXX
494
XXXX
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