HMC188MS8 Datasheet, PDF (3/4 Pages) Hittite Microwave Corporation – GaAs MMIC SMT PASSIVE FREQUENCY DOUBLER, 1.25 - 3.0 GHz INPUT

Outline Drawing
7
v04.0709
HMC188MS8 / 188MS8E
GaAs MMIC SMT PASSIVE FREQUENCY
DOUBLER, 1.25 - 3.0 GHz INPUT
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS].
3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
5. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
Package Information
Part Number
Package Body Material
HMC188MS8
Low Stress Injection Molded Plastic
Lead Finish
Sn/Pb Solder
HMC188MS8E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
MSL Rating
MSL1 ^[1]
MSL1 ^[2]
Package Marking ^[3]
H188
XXXX
H188
XXXX
Pin Description
Pin Number
Function
Description
Interface Schematic
1, 3 - 6, 8
GND
All ground leads must be soldered to PCB RF/DC ground.
2
RFIN
Pin is DC coupled and matched to 50 Ohms from 1.25 to 3.0 GHz
7
RFOUT
Pin is DC coupled and matched to 50 Ohms from 2.5 to 6.0 GHz
7 - 18
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