DAC16_15 Datasheet, PDF (3/12 Pages) Analog Devices – 16-Bit High Speed Current-Output DAC

DAC16
ABSOLUTE MAXIMUM RATINGS
CAUTION
(T_A = +25°C unless otherwise noted)
1. Stresses above those listed under “Absolute Maximum Rat-
V_CC to V_EE . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +25.0 V
V_CC to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +7.0 V
V_EE to AGND . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V, –18.0 V
DGND to AGND . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +0.3 V
REF GND to AGND . . . . . . . . . . . . . . . . . . . –0.3 V, +1.0 V
I_REF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 mA
Analog Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . 8 mA
ings” may cause permanent damage to the device. This is a
stress rating only and functional operation at or above this
specification is not implied. Exposure to the above maximum
rating conditions for extended periods may affect device
reliability.
2. Digital inputs and outputs are protected; however, perma-
nent damage may occur on unprotected units from high en-
Digital Input Voltage to DGND . . . . . . . . . . . . . . . . . . . ≤V_CC
Operating Temperature Range
FP, FS . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
ergy electrostatic fields. Keep units in conductive foam or
packaging at all times until ready to use. Use proper anti-
static handling procedures.
GS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C 3. Remove power before inserting or removing units from their
Dice Junction Temperature . . . . . . . . . . . . . . . . . . . . . +150°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65°C to +150°C
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . 1000 mW
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300°C
E ^{Package Type}
24-Lead Plastic DIP (P)
24-Lead Plastic SOL (S)
θ_JA1
θ_JC
Units
62
32
°C/W
70
22
°C/W
T _NOTE
1_{θJA is specified for worst case mounting conditions, i.e., θJA is specified for}
device in socket.
E ^{DICE CHARACTERISTICS}
V_CC DGND I_REF C_COMP I_OUT AGND
L _{DB15 (MSB)}
DB14
REF GND
V_EE
DB0 (LSB)
O _DB13
DB12
DB11
S _DB10
DB1
DB2
DB3
DB9 DB8 DB7 DB6 DB5 DB4
B _{Die Size 0.129 x 0.153 inch, 19,737 sq. mils}
(3.277 x 3.886 mm, 12.73 sq. mm)
O ^{The DAC16 Contains 330 Transistors.}
sockets.
PIN CONFIGURATION
24-Lead DIP (P, S)
I_REF 1
DGND 2
V_CC 3
DB15 (MSB) 4
24 C_COMP
23 I_OUT
22 AGND
21 REF GND
DB14 5 _DAC16 20 V_EE
DB13 6 _{TOP VIEW} 19 DB0 (LSB)
DB12 7 ^{(Not to Scale)} 18 DB1
DB11 8
17 DB2
DB10 9
16 DB3
DB9 10
15 DB4
DB8 ¹¹
14 DB5
DB7 ¹²
13 DB6
PIN DESCRIPTION
Pin
(P, S) Name
Description
1
2
3
4–19
20
21
22
23
24
I_REF
DGND
V_CC
DB15–DB0
V_EE
REF GND
AGND
I_OUT
C_COMP
Reference Current Input
Digital Ground
+5 V Digital Supply
16-Bit Digital Input Bus. DB15 is the MSB.
–15 V Analog Supply
Reference Current Return
Analog Ground/Output Reference
Current Output
Current Ladder Compensation
Substrate is V_EE Polarity.
Model
DAC16GS
DAC16FP
DAC16FS
DAC16GBC
Grade DNL (max)
±1
±2
±2
±1
ORDERING GUIDE
Temperature Ranges
0°C to +70°C
–40°C to +85°C
–40°C to +85°C
+25°C
Package Descriptions
24-Lead SOL
24-Lead PDIP
24-Lead SOL
Die
Package Options
R-24
N-24
R-24
REV. B
–3–