AD8185ARUZ Datasheet, PDF (3/16 Pages) Analog Devices – 380 MHz, 25 mA, Triple 2:1 Multiplexers

ABSOLUTE MAXIMUM RATINGS¹
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.0 V
DVCC to V_CC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 0.2 V
Internal Power Dissipation^{2, 3}
AD8183/AD8185 24-Lead TSSOP (RU) . . . . . . . . . . . . . 1 W
Input Voltage
IN0A, IN0B, IN1A, IN1B, IN2A, IN2B . . . . . V_EE ≤ V_IN ≤ V_CC
SELECT A/B, OE . . . . . . . . . . . . . . . . . . DGND ≤ V_IN ≤ V_CC
Output Short Circuit Duration . . . . . . . . . . . . . . . . . . . Indefinite³
Storage Temperature Range . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . . . 300°C
NOTES
1_{Stresses above those listed under Absolute Maximum Ratings may cause perma-}
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2_{Specification is for device in free air (TA = 25°C).}
3_{24-lead plastic TSSOP; θJA = 128°C/W. Maximum internal power dissipation (P D)}
should be derated for ambient temperature (T_A) such that P_D < (150°C–T_A)/θ_JA.
ORDERING GUIDE
Model
Temperature Package
Range
Description
Package
Option
AD8183ARU
AD8185ARU
AD8183-EVAL
AD8185-EVAL
–40°C to +85°C
–40°C to +85°C
24-Lead Plastic TSSOP
24-Lead Plastic TSSOP
Evaluation Board
Evaluation Board
RU-24
RU-24
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD8183/
AD8185 is limited by the associated rise in junction temperature.
The maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic, approximately 150°C. Temporarily exceeding this
limit may cause a shift in parametric performance due to a
change in the stresses exerted on the die by the package. Exceeding
a junction temperature of 175°C for an extended period can
result in device failure.
While the AD8183/AD8185 is internally short circuit protected,
this may not be sufficient to guarantee that the maximum junction
temperature (150°C) is not exceeded under all conditions. To
ensure proper operation, it is necessary to observe the maximum
power derating curves shown in Figure 2.
AD8183/AD8185
2.0
T_J = 150؇C
1.5
1.0
0.5
0
–50 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90
AMBIENT TEMPERATURE – ؇C
Figure 2. Maximum Power Dissipation vs. Temperature
PIN CONFIGURATION
IN0A 1
DGND 2
24 V_CC
23 OE
IN1A 3
22 SEL A/B
GND 4
IN2A 5
21 V_CC
AD8183/
AD8185 ^{20 OUT0}
V_CC 6 _{TOP VIEW} 19 V_EE
V_EE 7 ^{(Not to Scale)} 18 OUT1
IN2B 8
17 V_CC
GND 9
16 OUT2
IN1B 10
GND 11
15 V_EE
14 DVCC
IN0B 12
13 V_CC
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8183/AD8185 features proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
REV. 0
–3–