AD8002_01 Datasheet, PDF (3/20 Pages) Analog Devices – Dual 600 MHz, 50 mW Current Feedback Amplifier

AD8002
ABSOLUTE MAXIMUM RATINGS¹
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.2 V
Internal Power Dissipation²
Plastic DIP Package (N) . . . . . . . . . . . . . . . . . . . . . . . 1.3 W
Small Outline Package (R) . . . . . . . . . . . . . . . . . . . . . . 0.9 W
µSOIC Package (RM) . . . . . . . . . . . . . . . . . . . . . . . . . 0.6 W
Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . . ± V_S
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . ± 1.2 V
Output Short Circuit Duration
. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves
Storage Temperature Range N, R, RM . . . . . –65°C to +125°C
Operating Temperature Range (A Grade) . . . – 40°C to +85°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300°C
NOTES
1_{Stresses above those listed under Absolute Maximum Ratings may cause perma-}
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2_{Specification is for device in free air:}
8-Lead Plastic DIP Package: θ_JA = 90°C/W
8-Lead SOIC Package: θ_JA = 155°C/W
8-Lead µSOIC Package: θ_JA = 200°C/W
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8002 is limited by the associated rise in junction tempera-
ture. The maximum safe junction temperature for plastic
encapsulated devices is determined by the glass transition tem-
perature of the plastic, approximately 150°C. Exceeding this
limit temporarily may cause a shift in parametric performance
due to a change in the stresses exerted on the die by the package.
Exceeding a junction temperature of 175°C for an extended
period can result in device failure.
While the AD8002 is internally short circuit protected, this
may not be sufficient to guarantee that the maximum junction
temperature (150°C) is not exceeded under all conditions. To
ensure proper operation, it is necessary to observe the maximum
power derating curves.
2.0
8-LEAD PLASTIC-DIP PACKAGE
8-LEAD SOIC PACKAGE
1.5
T_J = 150؇C
1.0
8-LEAD ␮SOIC
0.5
PACKAGE
0
–50 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90
AMBIENT TEMPERATURE – ؇C
Figure 3. Plot of Maximum Power Dissipation vs.
Temperature
Model
AD8002AN
AD8002AR
AD8002AR-REEL
AD8002AR-REEL7
AD8002ARM
AD8002ARM-REEL
AD8002ARM-REEL7
ORDERING GUIDE
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
8-Lead PDIP
8-Lead SOIC
8-Lead SOIC 13" REEL
8-Lead SOIC 7" REEL
8-Lead µSOIC
8-Lead µSOIC 13" REEL
8-Lead µSOIC 7" REEL
Package Option
N-8
SO-8
SO-8
SO-8
RM-8
RM-8
RM-8
Brand Code
Standard
Standard
Standard
Standard
HFA
HFA
HFA
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8002 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
REV. D
–3–