ADXL313 Datasheet, PDF (26/28 Pages) Analog Devices – 3-Axis, ±0.5 g/±1 g/±2 g/±4 g Digital Accelerometer

ADXL313
SOLDER PROFILE
SUPPLIER T_P ≥ T_C
SUPPLIER t_P
T_C
T_C – 5°C
USER T_P ≤ T_C
USER t_P
Data Sheet
T_P
T_L
T_SMAX
T_SMAX
MAXIMUM RAMP-UP RATE = 3°C/sec
MAXIMUM RAMP-DOWN RATE = 6°C/sec
PREHEAT AREA
t_S
t_P
t_L
T_C – 5°C
25
Table 20. Recommended Soldering Profile^{1, 2}
TIME 25°C TO PEAK
TIME
Figure 29. Recommended Soldering Profile
Profile Feature
Average Ramp Rate (TL to TP)
Preheat
Minimum Temperature (TSMIN)
Maximum Temperature (TSMAX)
Time (TSMIN to TSMAX) (tS)
TSMAX to TL
Ramp-Up Rate
Time Maintained Above Liquidous (tL)
Liquidous Temperature (TL)
Time (tL)
Peak Temperature (TP)
Time Within 5°C of Actual Peak Temperature (tP)
Ramp-Down Rate
Time 25°C to Peak Temperature
Sn63/Pb37
3°C/sec maximum
100°C
150°C
60 sec to 120 sec
3°C/sec
183°C
60 sec to 150 sec
240°C + 0°C/−5°C
10 sec to 30 sec
6°C/sec maximum
6 min maximum
Condition
Pb-Free
3°C/sec maximum
150°C
200°C
60 sec to 180 sec
3°C/sec
217°C
60 sec to 150 sec
260°C + 0°C/−5°C
20 sec to 40 sec
6°C/sec maximum
8 min maximum
1 _{Based on JEDEC standard J-STD-020D.1.}
2 _{For best results, make sure that the soldering profile is in accordance with the recommendations of the manufacturer of the solder paste used.}
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