ADA4500-2_13 Datasheet, PDF (25/25 Pages) Analog Devices – 10 MHz, 14.5 nV/√Hz, Rail-to-Rail I/O, Zero Input Crossover Distortion Amplifier

ADA4500-2
OUTLINE DIMENSIONS
PIN 1 INDEX
AREA
0.80
0.75
0.70
SEATING
PLANE
3.10
3.00 SQ
2.90
0.50 BSC
5
8
TOP VIEW
0.30
0.25
0.20
0.50
0.40
0.30
EXPOSED
PAD
1.70
1.60 SQ
1.50
4
1
BOTTOM VIEW
PIN 1
INDICATOR
(R 0.15)
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.203 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-229-WEED
Figure 67. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
3 mm × 3 mm Body, Very, Very Thin, Dual Lead
(CP-8-12)
Dimensions shown in millimeters
3.20
3.00
2.80
3.20
3.00
2.80
8
5
5.15
4.90
4.65
1
4
PIN 1
IDENTIFIER
0.65 BSC
0.95
15° MAX
0.85
1.10 MAX
0.75
0.15
0.05
COPLANARITY
0.40
0.25
6°
0.23
0°
0.09
0.80
0.55
0.40
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 68. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
Data Sheet
ORDERING GUIDE
Model¹
ADA4500-2ACPZ-R7
ADA4500-2ACPZ-RL
ADA4500-2ARMZ
ADA4500-2ARMZ-R7
ADA4500-2ARMZ-RL
Temperature
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
1 _{Z = RoHS Compliant Part.}
Package Description
8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
Package Option
CP-8-12
CP-8-12
RM-8
RM-8
RM-8
Branding
A2Z
A2Z
A2Z
A2Z
A2Z
©2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D10617-0-10/12(A)
Rev. A | Page 24 of 24