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ADSP-TS203S Datasheet, PDF (21/40 Pages) Analog Devices – TigerSHARC Embedded Processor
Preliminary Technical Data
ADSP-TS203S
ADSP-TS203S—SPECIFICATIONS
Note that component specifications are subject to change with-
out notice. For information on Link port electrical
characteristics, see Link Port Low-Voltage, Differential-Signal
(LVDS) Electrical Characteristics and Timing on page 27.
RECOMMENDED OPERATING CONDITIONS
Parameter
Test Conditions
Min Typ Max Unit
VDD
VDD_A
VDD_IO
VDD_DRAM
TCASE
VIH
VIL
IDD
IDD_A
IDD_IO
Internal Supply Voltage
0.95
1.05 V
Analog Supply Voltage
0.95
1.05 V
I/O Supply Voltage
2.38
2.63 V
Internal DRAM Supply Voltage
1.425
1.575 V
Case Operating Temperature
–40
+85 °C
High-Level Input Voltage1
Low-Level Input Voltage1
VDD supply current for typical activity2
@ VDD, VDD_IO = max
@ VDD, VDD_IO = min
@ CCLK=500 MHz, VDD=1.0 V, TCASE=25ºC
1.7
3.63 V
–0.5
0.8 V
2.39
A
VDD_A supply current for typical activity
@ CCLK=500 MHz, VDD=1.0 V, TCASE=25ºC
VDD_IO supply current for typical activity2 (DRAM @ SCLK=100 MHz, VDD_IO=2.5 V, TCASE=25ºC,
Internal Regulator Disabled)
ENEDREG=0
20 50 mA
0.16
A
IDD_DRAM
VDD_DRAM supply current for typical activity2,3
VREF
SCLK_VREF
Voltage reference
Voltage reference
@ CCLK=500 MHz, VDD_DRAM=1.5 V,
TCASE=25ºC, ENEDREG=0
0.40
A
(VDD_IO × 0.56)4
V
(VDD_IO × 0.56)4
V
1 Applies to input and bidirectional pins.
2 For details on internal and external power calculation issues, see the EE-170, Estimating Power for the ADSP-TS201S on the Analog Devices website.
3 For ENEDREG=1, the internal DRAM supply is used; there is no IDD_DRAM for this condition.
4 If the clock driver voltage is > 2.8 V and the clock driver voltage is used to generate SCLK_VREF, this formula becomes: (VCLOCK_DRIVE/2) ±5%)
ELECTRICAL CHARACTERISTICS
Parameter
Test Conditions
Min
Max Unit
VOH
High-Level Output Voltage1
VOL
Low-Level Output Voltage1
@VDD_IO = min, IOH = –2 mA
@VDD_IO = min, IOL = 4 mA
2.18
V
0.4 V
IIH
High-Level Input Current
@VDD_IO = max, VIN = VDD_IO max
10 µA
IIH_PU
High-Level Input Current
@VDD_IO = max, VIN = VDD_IO max
50 µA
IIH_PD
High-Level Input Current
@VDD_IO = max, VIN = VDD_IO max
0.3
0.76 mA
IIL
Low-Level Input Current
@VDD_IO = max, VIN = 0V
10 µA
IIL_PU
Low-Level Input Current
@VDD_IO = max, VIN = 0V
0.3
0.76 mA
IIL_PU_AD
Low-Level Input Current
@VDD_IO = max, VIN = 0V
0.03
0.1 mA
IOZH
Three-State Leakage Current High
@VDD_IO = max, VIN = VDD_IO max
10 µA
IOZH_PD
Three-State Leakage Current High
@VDD_IO = max, VIN = VDD_IO max
0.3
0.76 mA
IOZL
Three-State Leakage Current Low
@VDD_IO = max, VIN = 0V
10 µA
IOZL_PU
Three-State Leakage Current Low
@VDD_IO = max, VIN = 0
0.3
0.76 mA
IOZL_PU_AD Three-State Leakage Current Low
@VDD_IO = max, VIN = 0
0.03
0.1 mA
IOZL_OD
CIN
Three-State Leakage Current Low
Input Capacitance2,3
@VDD_IO = max, VIN = 0V
@fIN = 1MHz,TCASE = 25C, VIN = 2.5V
4
7.6 mA
3
pF
Parameter name suffix conventions: no suffix = applies to pins without pullup or pull down resistors, _PD = applies to pin types (pd) or
(pd_0), _PU = applies to pin types (pu) or (pu_0), _PU_AD = applies to pin types (pu_ad), _OD = applies to pin types OD
1 Applies to output and bidirectional pins.
2 Applies to all signals.
3 Guaranteed but not tested.
Rev. PrB | Page 21 of 40 | December 2003