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AD8557ARZ Datasheet, PDF (21/24 Pages) Analog Devices – Digitally Programmable Sensor Signal Amplifier
OUTLINE DIMENSIONS
5.00 (0.1968)
4.80 (0.1890)
8
4.00 (0.1574)
3.80 (0.1497) 1
5
6.20 (0.2441)
4 5.80 (0.2284)
0.25 (0.0098)
0.10 (0.0040)
1.27 (0.0500)
BSC
1.75 (0.0688)
1.35 (0.0532)
COPLANARITY
0.10
SEATING
PLANE
0.51 (0.0201)
0.31 (0.0122)
0.50 (0.0196) 45°
0.25 (0.0099)
8°
0°
1.27 (0.0500)
0.25 (0.0098) 0.40 (0.0157)
0.17 (0.0067)
COMPLIANT TO JEDEC STANDARDS MS-012-AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 48. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-8)
Dimensions shown in millimeters and (inches)
PIN 1
INDICATOR
4.00
BSC SQ
TOP
VIEW
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.35
0.80
0.30
SEATING
PLANE
0.25
0.60 MAX
3.75
BSC SQ
0.65 BSC
0.50
0.40
0.30
0.60 MAX
13
12
16 1
EXPOSED
PAD
(BOTTOM VIEW)
9
8
54
PIN 1
INDICATOR
2.50
2.35 SQ
2.20
0.25 MIN
0.05 MAX
0.02 NOM
0.20 REF COPLANARITY
0.08
1.95 BSC
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
Figure 49. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-16-10)
Dimensions shown in millimeters
AD8557
Rev. C | Page 21 of 24